WMSIC Electronic Components

FOJAN FRC0603F3571TS

ModelFRC0603F3571TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F3571TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F3571TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
3.57kΩ
Electronic Component
1
Electronic Component
BM0264525294
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F3571TS 厚膜贴片电阻产品概述

FRC0603F3571TS是富捷电子(FOJAN)推出的一款小型化厚膜贴片电阻,采用0603标准封装,针对低功耗、宽温适应性场景优化设计,兼顾精度表现与成本优势,广泛应用于消费电子、工业控制等领域。

一、核心属性与参数

作为典型厚膜贴片电阻,该产品核心参数明确,可满足多数通用电路需求:

  • 品牌类型:FOJAN(富捷)厚膜贴片电阻;
  • 封装尺寸:0603(英制代码,对应公制1.6mm×0.8mm,厚度约0.45mm);
  • 阻值精度:3.57kΩ(阻值代码“3571”对应357×10¹=3570Ω),精度±1%;
  • 功率电压:额定功率100mW,最大工作电压75V;
  • 温度特性:温度系数±100ppm/℃,工作温度范围-55℃~+155℃;
  • 结构组成:氧化铝陶瓷基底+厚膜电阻膜+环氧树脂涂层。

二、封装与工艺特点

1. 0603小型化封装优势

0603封装是贴片电阻主流小型化规格,体积仅为0805封装的40%左右,可有效减少PCB占用空间,适配智能手机主板、小型传感器模块等高密度贴装场景。同时,该封装引脚间距与焊盘尺寸兼容多数回流焊、波峰焊设备,兼容性强。

2. 厚膜工艺核心特性

采用丝网印刷厚膜工艺制造:

  • 基底材料:氧化铝陶瓷基底,具备优异热稳定性与化学耐腐蚀性;
  • 电阻膜形成:电阻浆料(含钌基氧化物)经高温烧结形成致密膜层,附着力强、阻值一致性好;
  • 涂层保护:外层环氧树脂可隔绝潮气、灰尘,提升长期可靠性。

三、性能优势解析

1. 功率与电压的平衡设计

100mW额定功率针对低功耗信号电路(偏置、滤波、分压)优化,实际使用中50%降额(≤50mW)可确保长期阻值漂移≤1%;75V最大工作电压覆盖5V/12V/24V等常见低压系统,避免电压击穿风险。

2. 精度与温漂的实用化平衡

±1%精度满足多数通用场景(如消费电子音频滤波、工业PLC输入限流),若需更高精度可选择薄膜电阻,但成本显著提升。±100ppm/℃温漂在宽温范围内,阻值最大变化约0.21%,叠加±1%精度偏差,总偏差≤±1.21%,可满足多数设计需求。

3. 宽温适应性的场景延伸

-55℃~+155℃超工业级范围,支持:

  • 高温环境短期工作(如汽车发动机舱附近);
  • 低温户外设备(如北方冬季物联网节点);
  • 高温存储(无铅回流焊前元器件存储)。

四、典型应用场景

结合参数特性,该产品适用于:

  1. 消费电子:智能手机电源分压电阻、智能家居传感器信号调理;
  2. 工业控制:小型PLC接口限流电阻、传感器信号放大偏置;
  3. 汽车电子:车载娱乐音频滤波、车身控制模块限流;
  4. 物联网:低功耗传感器节点信号处理、LoRa模块电源分压。

五、可靠性与使用注意

1. 可靠性表现

  • 额定功率85℃工作1000h,阻值漂移≤±0.5%;
  • 85℃/85%RH环境存储1000h,阻值变化≤±0.3%;
  • 抗振动(10~2000Hz,2g)、冲击(1000m/s²,1ms)符合IEC标准。

2. 使用注意事项

  • 功率降额:实际功率≤50mW(额定50%);
  • 电压限制:工作电压≤75V;
  • 焊接工艺:回流焊峰值温度240~260℃(≤10s),手工焊≤350℃(≤3s);
  • 存储条件:湿度≤60%、温度0~40℃,避免受潮。

总结

FRC0603F3571TS凭借小型化封装、平衡的精度温漂、宽温适应性与成本优势,成为消费电子、工业控制等领域的通用选型,适合对阻值精度要求不苛刻但需兼顾体积与批量成本的电路设计。

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