WMSIC Electronic Components

FOJAN FRC1206F4700TS

ModelFRC1206F4700TS
Package1206
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC1206F4700TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC1206F4700TS
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
470Ω
Electronic Component
1
Electronic Component
BM0264521498
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC1206F4700TS 厚膜贴片电阻产品概述

一、产品基本属性

FRC1206F4700TS是富捷(FOJAN)品牌推出的1206封装厚膜贴片电阻,属于工业级通用电阻系列。该产品采用成熟的厚膜丝网印刷工艺,适配自动化贴装产线,兼顾成本与性能,广泛用于消费电子、工业控制、通信等领域的电路设计。

二、核心性能参数

产品关键参数明确,满足大多数中精度电路需求:

  • 阻值:470Ω(标称值,符合E96系列标准)
  • 精度:±1%(阻值偏差控制在±4.7Ω内,适用于信号调理、分压等场景)
  • 最大耗散功率:250mW(需注意功率降额使用,避免长期过热)
  • 最大工作电压:200V(绝缘层耐受极限,长期使用建议降额至150V内)
  • 温度系数(TCR):±100ppm/℃(阻值随温度变化的稳定性,100℃温差下阻值变化≤4.7Ω)
  • 工作温度范围:-55℃~+155℃(覆盖工业级高低温环境,如户外设备、车载辅助电路)

三、设计与工艺特点

  1. 厚膜工艺优势:
    采用厚膜电阻膜层(厚度通常为1-10μm),相比薄膜电阻成本更低,膜层致密性好,阻值一致性达±0.5%以内(量产批次),适合大规模量产。
  2. 1206封装适配:
    尺寸为3.2mm×1.6mm(英制0805),兼容主流贴片机(如ASM、松下系列),焊接引脚间距符合IPC标准,减少虚焊风险。
  3. 终端电极设计:
    采用“镍阻挡层+无铅锡镀层”结构,提升焊接附着力(剪切强度≥15N),同时符合RoHS环保要求,避免铅污染。

四、典型应用场景

该电阻的参数特性适配以下常见场景:

  1. 消费电子:手机/平板主板的信号分压电路、按键电路限流、电池保护板辅助电阻;
  2. 工业控制:PLC模块的I/O接口限流、传感器信号调理(如温度传感器分压)、小型电机驱动反馈电阻;
  3. 通信设备:路由器/交换机的电源滤波分压、射频电路辅助匹配、LED指示灯限流;
  4. 汽车电子(非车规级辅助场景):车载显示屏背光驱动限流、车内传感器信号处理(需结合整车温湿度需求确认);
  5. 小型电源:DC-DC转换器的反馈分压、5V/12V电源的过流保护限流电阻。

五、可靠性与环境适应性

  1. 温区稳定性:
    在-55℃~+155℃范围内,阻值变化不超过±1%(基于TCR计算:25℃到-55℃温差80℃,变化量=470×100e-6×80=3.76Ω,符合精度要求);
  2. 功率耐久性:
    250mW功率下连续工作1000小时,阻值漂移≤0.5%,符合IEC 60115-1电阻可靠性标准;
  3. 耐湿性能:
    厚膜膜层致密,经85℃/85%RH湿热测试1000小时后,阻值变化≤1%,适合湿度变化较大的户外或工业环境。

六、选型与使用注意事项

  1. 功率降额:
    建议实际工作功率不超过最大耗散功率的70%(即175mW),避免长期过热导致阻值漂移或失效;
  2. 焊接工艺:
    回流焊峰值温度控制在240℃~260℃,时间≤10秒;手工焊接温度≤350℃,时间≤3秒,防止过温损坏膜层;
  3. 电压限制:
    长期工作电压不超过150V(降额30%),避免绝缘层老化击穿;
  4. 存储条件:
    常温干燥环境存储(温度25℃±5℃,湿度≤60%),开封后12个月内使用完毕,避免电极氧化。

该产品凭借平衡的性能与成本优势,成为中低端电子设备电阻选型的主流方案之一,可替代同类1206封装470Ω±1%厚膜电阻。

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