Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0603F1603TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F1603TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F1603TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 160kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264520847
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F1603TS 厚膜贴片电阻产品概述
一、产品核心定位与身份
FRC0603F1603TS是富捷电子（FOJAN） 推出的通用型厚膜贴片电阻，主打小功率、常规精度的基础电阻需求，适配多数电子设备的信号调理、分压限流等场景。作为0603封装的标准器件，它兼具成本优势与可靠性，是量产电子终端的常用被动元件之一。
二、关键电气性能参数解析
这款电阻的核心指标清晰覆盖通用电路需求：
- 阻值与精度：标称160kΩ（代码“1603”，即160×10³Ω），精度±1%——满足工业级、消费电子对阻值一致性的要求，无需额外校准即可稳定工作；
- 功率与电压：额定功率100mW，最大工作电压75V——适配小信号电路（如传感器偏置、MCU外围），避免功率过载风险；
- 温度特性：温度系数±100ppm/℃，工作温度-55℃~+155℃——100℃温差下阻值变化仅1.6kΩ，且能承受极端高低温，适合工业现场或高温场景；
- 工艺特性：厚膜工艺制造，电阻膜层稳定性强，长期工作无明显漂移。
三、物理封装与工艺特点
- 封装规格：0603贴片封装（公制1.6mm×0.8mm），适合SMT自动化贴装，生产效率高；紧凑尺寸可节省PCB空间，尤其适配便携设备（如智能手机、智能穿戴）；
- 基底与膜层：陶瓷基底+丝网印刷烧结厚膜，兼具耐温性与抗冲击性，避免机械应力对阻值的影响；
- 环保认证：符合RoHS、REACH标准，无铅无卤，适配绿色电子产品设计。
四、环境适应性与可靠性
- 宽温耐受：-55℃+155℃覆盖工业级（-40℃+85℃）与部分汽车电子温度需求，极端天气或高温作业区域仍稳定；
- 抗潮与机械性能：厚膜工艺抗潮性好，封装紧凑能承受轻微振动（符合电子设备常规振动测试）；
- 长期稳定：老化测试后阻值漂移率低，适合长期运行设备（如PLC、通信基站模块）。
五、典型应用场景
因参数适配性强，广泛用于：
- 消费电子：手机/平板按键电路、音频分压、LED限流；
- 工业控制：传感器信号调理、PLC输入输出限流；
- 通信设备：路由器射频前端、电源模块轻载分压；
- 汽车电子：车载中控辅助电路、传感器滤波（非高压大功率场景）；
- 智能家居：智能音箱、温控器基础电路。
六、品牌与量产优势
富捷电子（FOJAN）作为成熟被动元件厂商，这款电阻具备：
- 一致性好：批量生产阻值偏差≤±1%，批次差异极小；
- 成本可控：通用设计+成熟工艺，降低终端BOM成本；
- 供货稳定：常规型号备库存，交期短，适配快速生产需求。
综上，FRC0603F1603TS是一款“低成本、高可靠、宽适配”的通用厚膜贴片电阻，是电子终端量产的优选基础元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
