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FOJAN FRC0603F1102TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F1102TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F1102TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 11kΩ
- Electronic Component
- 1
- Electronic Component
- BM0261485684
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F1102TS 产品概述
一、产品简介
FRC0603F1102TS 是富捷（FOJAN）系列的贴片厚膜电阻，封装为0603（公制1608），阻值 11 kΩ，精度 ±1%，额定功率 100 mW。工作电压可达 75 V，温度系数（TCR）为 ±100 ppm/℃，工作温度范围 -55℃ ~ +155℃。该元件针对表面贴装（SMT）工艺设计，适合自动贴装与回流焊接。
二、主要技术规格
- 阻值：11 kΩ（11,000 Ω）
- 精度：±1%
- 功率额定：100 mW（在规定环境温度下）
- 最大工作电压：75 V
- 温度系数：±100 ppm/℃
- 工作温度：-55℃ ~ +155℃
- 类型：厚膜电阻（贴片）
- 封装：0603（1.6 mm × 0.8 mm）
- 品牌：FOJAN（富捷）
三、产品特点
- 精度高：±1% 满足多数精密信号分压、测量与偏置场合需求。
- 稳定性好：厚膜工艺在常温与宽温范围内具有可靠的电阻稳定性与抗热冲击性能。
- 适配 SMT：0603 小尺寸，支持高速自动贴装与回流焊工艺，便于高密度布板。
- 宽温适应：-55℃ 至 +155℃ 的工作温度范围适合工业与消费类电子应用。
四、典型应用场景
- 消费电子：便携设备、显示驱动、背光控制等。
- 通信设备：终端滤波、偏置网络、阻抗匹配与分压器。
- 工业与仪表：传感器信号调理、采样电阻、低功耗测量电路（注意功率约束）。
- 汽车电子（非高功率关键回路）：需符合汽车额定与认证时另行确认。
五、封装与工艺建议
- 封装形式适用于带卷（Tape & Reel）自动贴装；可根据订单提供不同卷带数量规格。
- 回流焊接建议遵循制造商与IPC/JEDEC标准回流曲线（典型 Pb‑free 峰值约 260℃，在高温区停留时间尽量控制较短），以避免过热导致电阻性能变化。
- PCB 布局建议保证两端焊盘热对称，避免“墓碑”效应；合理设计焊盘尺寸与焊膏量以获得良好焊接质量。
六、可靠性与降额使用
- 在高环境温度下需进行功率降额：随着环境温度上升，允许的功耗应按厂商推荐的降额曲线调整，以保证长期可靠性。常见规则是在高于某一温度（如 70℃）时线性降额直至最大工作温度。
- 储存与处理时避免潮湿和机械应力，必要时按湿敏等级（MSL）进行预烘烤处理后再回流焊。
七、选型与注意事项
- 若电路存在高瞬态电压或脉冲能量，应确认 75 V 最大工作电压及能耗能力是否满足；必要时考虑更大功率或更高电压等级电阻。
- 对噪声、长期漂移有更高要求的应用建议考虑金属膜或薄膜类精密电阻替代件。
- 订购前确认包装方式、熔点兼容性及是否需通过特殊认证（如根据信息或汽车标准）。
若需获取产品规格书（Datasheet）、回流曲线、封装尺寸图或样品与批量报价，我可以协助整理并提供获取渠道。
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