WMSIC Electronic Components

FOJAN FRC0603F1022TS

ModelFRC0603F1022TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1022TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1022TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
10.2kΩ
Electronic Component
10
Electronic Component
BM0264520451
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1022TS 贴片厚膜电阻产品概述

一、产品核心身份与定位

FRC0603F1022TS是FOJAN富捷电子推出的通用型贴片厚膜电阻,型号中“0603”对应国际标准贴片封装(尺寸1.6mm×0.8mm),“1022”解码为标称阻值10.2kΩ,“F”代表精度等级±1%。作为一款基础无源元件,它专为小型化、低成本电路设计,覆盖消费电子、工业控制等多领域应用,是批量生产中替代进口同类产品的优选方案。

二、关键性能参数深度解析

该电阻的参数设计围绕“稳定可靠+适配小信号”展开,核心指标如下:

  1. 阻值与精度:标称阻值10.2kΩ,精度±1%——满足绝大多数信号调理、分压限流电路的偏差要求,无需额外校准即可实现稳定输出;
  2. 功率与电压:额定功率100mW,最大工作电压75V——适配小信号场景(如传感器前端、MCU外围电路),避免大功率过载风险;
  3. 温度特性:温度系数±100ppm/℃,工作温度范围-55℃+155℃——宽温环境下阻值漂移可控(每℃变化±1.02Ω),可兼容工业级(-40℃+85℃)及部分车载辅助电路;
  4. 封装适配:0603贴片封装——体积小巧,支持高密度PCB布线,兼容回流焊、波峰焊等自动化工艺,降低组装成本。

三、工艺与设计优势

采用丝网印刷+高温烧结厚膜工艺,将电阻浆料印刷在氧化铝陶瓷基片上,经烧结形成致密电阻膜,具备三大核心优势:

  • 成本可控:无需真空镀膜等复杂步骤,在保证性能的前提下降低制造成本,适合批量应用;
  • 稳定性优异:陶瓷基片热膨胀系数与电阻膜匹配,温度循环下阻值变化小,长期可靠性高于普通碳膜电阻;
  • 环保兼容:表面镀镍/锡层,适配无铅焊接工艺,符合RoHS环保要求,满足现代电子制造的合规标准。

四、典型应用场景

  1. 消费电子:手机/平板的音频分压电路、智能穿戴的传感器信号放大;
  2. 工业控制:PLC模块的输入输出限流、小型电机驱动的反馈电阻;
  3. 通信设备:5G小基站的射频前端辅助电路、光纤收发器的偏置电路;
  4. 汽车电子:车载中控背光调节、胎压监测模块的信号调理(需确认具体场景的振动要求,宽温特性适配多数辅助电路)。

五、使用与选型注意事项

  1. 功率降额:实际功率建议不超过额定值的70%(即70mW),避免长期过载导致阻值漂移;
  2. 电压限制:工作电压不得超过75V,防止击穿损坏;
  3. 焊接工艺:回流焊峰值温度≤245℃、时间≤10s,避免过热破坏电阻膜;
  4. 存储条件:未开封产品存储于常温(15~35℃)、干燥(湿度≤60%)环境,开封后1个月内使用完毕,防止受潮影响焊接。

总结:FRC0603F1022TS凭借“小体积、高可靠、低成本”的特点,成为电子设计中基础电阻的优选方案,适配多领域小型化电路需求,是FOJAN富捷电子针对通用市场推出的成熟产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.