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FOJAN FRC0603F5492TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F5492TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F5492TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 54.9kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264524829
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F5492TS 产品概述
一、产品简介
FRC0603F5492TS 为 FOJAN(富捷) 系列贴片厚膜电阻，封装尺寸为 0603（1608公制），阻值为 54.9kΩ，精度 ±1%，额定功率 100mW，额定工作电压 75V，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃ 至 +155℃。该器件适用于高密度表贴电路中需要中高阻值且稳定性的通用场合。
二、主要电气与环境参数
- 阻值：54.9kΩ，公差 ±1%（精密匹配与分流应用可选用相同公差等级）
- 额定功率：100mW（额定值通常在环境温度 70℃ 下定义，实际使用时需考虑温度降额）
- 额定工作电压：75V，满足常见低压电子设备电压需求
- 温度系数：±100ppm/℃，在温度变化场合具有良好的阻值稳定性
- 工作温度范围：-55℃ 至 +155℃，适应宽温环境
三、特性与可靠性
- 结构：厚膜工艺，抗冲击、抗震动能力良好，适合自动贴装生产
- 稳定性：热噪声低，长期漂移小，符合常见元器件可靠性测试要求
- 环境适应：可在工业温区工作，耐湿热与热冲击性能优良（具体认证与试验结果请参照出厂数据表）
四、使用建议
- 焊接：兼容无铅回流工艺（请根据具体工艺控制回流峰值温度及时长，避免超温）
- 功率降额：在高环境温度下应按厂家提供的降额曲线执行，以保证长期可靠性
- 布局：建议避免将大量功耗集中在单一小区域，保持散热路径通畅
- 存储与搬运：避免受潮与静电损伤，建议卷带包装并按常规元器件仓储条件保存
五、典型应用场景
适用于消费电子、通信设备、仪表仪器、工业控制板、传感器接口与滤波/偏置网络等需要稳定中高阻值的小型化电路。
六、采购与替换
FRC0603F5492TS 常见为卷带（Tape & Reel）方式供货，便于 SMT 贴片生产。替换时注意匹配阻值、功率、工作电压与 TCR 等关键参数，避免因外形相近而忽略热性能与额定电压限制。
如需更详尽的电气参数、降额曲线与可靠性测试报告，请参考 FOJAN 官方数据表或联系供应商获取原厂资料。
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