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FOJAN FRC0603F4992TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F4992TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F4992TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 49.9kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264520358
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F4992TS厚膜贴片电阻产品概述
一、产品定位与核心属性
FRC0603F4992TS是FOJAN（富捷）品牌推出的0603封装工业级厚膜贴片电阻，聚焦小型化、宽温适应性与基础电路的精准阻抗匹配，可替代传统插件电阻，适配消费电子、工业控制、汽车辅助电路等领域的低功耗、中低压场景，是自动化批量生产的优选方案。
二、关键电气与物理参数
该电阻核心参数经严格校准，关键指标如下：
- 阻值与精度：标称阻值49.9kΩ（丝印标识“4992”），精度±1%，满足多数电路阻抗匹配需求；
- 功率与电压：额定功率100mW（0603封装典型值），最大工作电压75V，适配低功耗电路电压范围；
- 温度特性：温度系数±100ppm/℃，工作温度-55℃~+155℃，宽温下阻值稳定性优异；
- 物理封装：0603英制封装（公制1608，尺寸1.6mm×0.8mm×0.5mm），兼容SMT自动化贴装。
三、封装工艺与结构特点
采用厚膜电阻工艺制造，核心结构具备以下优势：
- 陶瓷基底：高纯度氧化铝陶瓷，热稳定性与机械强度优异，降低热应力影响；
- 电阻层：丝网印刷钌基浆料+高温烧结，形成致密电阻层，阻值一致性好；
- 电极与防护：银钯合金电极（兼容焊锡），环氧树脂保护层防湿气/灰尘侵蚀，提升抗老化能力。
0603封装适配电子设备小型化趋势，可实现高密度PCB紧凑布局。
四、性能优势解析
相比同类产品，核心优势突出：
- 宽温稳定性：±100ppm/℃温漂，-55℃~+155℃内阻值变化≤0.05%（25℃基准），避免极端温度漂移；
- 精度可靠性：±1%精度通过批量一致性测试，满足信号调理、分压电路精准需求；
- 工艺兼容性：表面贴装适配回流焊/波峰焊，焊接良率高，适合大规模量产；
- 环境适应性：环氧树脂防护层耐潮湿、耐腐蚀，适配工业现场、户外辅助设备等复杂环境。
五、典型应用场景
参数特性决定其适用于以下场景：
- 消费电子：手机/平板的电源分压、音频滤波电阻；
- 工业控制：PLC接口电阻、传感器信号调理（如温度传感器分压）；
- 汽车电子：车载仪表盘背光控制、传感器接口（宽温适配舱内外温度）；
- 通信设备：小型基站/路由器的阻抗匹配、低功耗电源限流电阻；
- 医疗设备：便携式监护仪信号采集、医疗传感器偏置电阻。
六、品牌与可靠性保障
FOJAN（富捷）具备20余年被动元件生产经验，产品管控严格：
- 符合RoHS 2.0、REACH环保法规，无铅无卤；
- 批量生产经100%阻值测试+温度循环测试，确保一致性；
- 5年保质期，提供售后技术支持，满足长期稳定供货需求。
该产品以高性价比、稳定性能成为通用电路的核心阻抗元件，可适配多领域电子设备的小型化、宽温化设计需求。
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