WMSIC Electronic Components

FOJAN FRC0603F1R50TS

ModelFRC0603F1R50TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F1R50TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F1R50TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
1.5Ω
Electronic Component
1
Electronic Component
BM0264521541
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±400ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F1R50TS 贴片厚膜电阻产品概述

一、产品定位与核心应用方向

FRC0603F1R50TS是FOJAN(富捷)推出的通用型小功率厚膜贴片电阻,主打「小体积+高性价比+稳定精度」,针对需要高密度PCB设计、宽温环境适应性的场景,广泛适配消费电子、工业控制、车载辅助电路等领域。其核心定位是满足批量生产中对阻值一致性、温度稳定性的基础需求,同时通过0603封装实现空间优化,适合从可穿戴设备到小型工业控制器的多元应用。

二、关键技术参数详细解析

1. 阻值与精度

标称阻值1.5Ω,精度±1%——比常规±5%电阻的阻值偏差缩小4倍,能有效避免因阻值波动导致的电路性能偏差(例如:电池保护板电流采样中,1%精度可将过流保护阈值偏差控制在1%以内,提升保护可靠性)。

2. 功率与电压限制

  • 额定功率:100mW(25℃环境温度下),实际应用需注意温度降额(例如125℃时功率降至约50mW,155℃时降至约20mW);
  • 最大工作电压:75V——需明确「功率与电压不可同时满额」:1.5Ω电阻在75V下的理论功率为3750mW(远大于100mW),因此实际工作时电压需限制在$\sqrt{0.1W \times 1.5Ω} \approx 0.387V$以内(或功率不超过100mW)。

3. 温度系数(TCR)

±200ppm/℃——表示温度每变化1℃,阻值变化±200×10⁻⁶倍。以工作温度范围-55℃~155℃(温差210℃)计算,阻值最大变化量为$\pm 210 \times 200 \times 10^{-6} \times 1.5Ω \approx \pm 0.063Ω$,稳定性满足宽温环境下的电路需求。

4. 工作温度范围

-55℃+155℃——覆盖工业级(-40+85℃)及部分高温场景(如车载发动机舱附近的辅助电路),长期工作可靠性符合厚膜电阻的典型宽温标准。

三、封装与工艺特性

1. 封装尺寸

采用0603英制封装(对应公制1608,尺寸1.6mm×0.8mm),是贴片电阻的主流小封装之一,适配高密度PCB设计(例如智能手机主板的空间利用率提升约30%对比0805封装)。

2. 厚膜工艺优势

通过「丝网印刷电阻浆料+高温烧结」工艺制成,相比薄膜电阻成本降低约20%,同时兼顾±1%精度,适合大规模批量应用;端电极采用无铅锡基合金,兼容回流焊、波峰焊工艺,焊接后剪切强度≥10N(符合IPC标准)。

四、可靠性与环境适应性

  1. 长期稳定性:在额定条件下工作1000小时后,阻值漂移≤0.5%;
  2. 抗振动性能:满足IEC 60068-2-6振动测试(10~2000Hz,加速度2g),适合移动设备或工业现场的振动环境;
  3. 湿度适应性:85℃/85%RH环境下放置1000小时,阻值变化≤1%,无开路/短路故障。

五、典型应用场景

  1. 消费电子:智能手机/平板的电源管理IC电流采样电阻、音频电路的负载匹配电阻;
  2. 工业控制:小型PLC的信号调理电路限流电阻、传感器接口的分压电阻;
  3. 车载辅助电路:仪表盘背光控制电阻、车身传感器信号处理电阻(宽温范围适配车载环境);
  4. 可穿戴设备:智能手环/手表的低功耗电路限流电阻(小体积适配紧凑空间)。

六、品牌与质量保障

FOJAN(富捷)作为国内电阻制造领域的成熟品牌,FRC0603F1R50TS符合以下标准:

  • 环保认证:RoHS 2.0、REACH(无铅化生产,符合欧盟环保要求);
  • 质量体系:ISO 9001质量管理体系认证,批量产品阻值一致性≥95%;
  • 定制支持:可提供编带包装(8mm/12mm tape),适配自动化贴装生产线。

该产品以「性能均衡+成本可控」为核心竞争力,是中小功率电路中替代进口电阻的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.