WMSIC Electronic Components

FOJAN FRC0603F8661TS

ModelFRC0603F8661TS
Package0603
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0603F8661TS
Type
FOJAN
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0603F8661TS
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
8.66kΩ
Electronic Component
10
Electronic Component
BM0264603026
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0603F8661TS 厚膜贴片电阻产品概述

一、产品基本定位与身份信息

FRC0603F8661TS是富捷电子(FOJAN)推出的常规精度厚膜贴片电阻,采用行业标准0603封装(英制尺寸,对应公制1608规格)。该产品定位于中小功率电子电路的通用电阻器件,兼顾精度、功率与环境适应性,可覆盖消费电子、工业控制、汽车辅助电路等多领域的常规应用需求。

型号命名遵循行业惯例:

  • “FRC”:富捷厚膜贴片电阻系列标识;
  • “0603”:封装尺寸(英制,对应公制1.6mm×0.8mm);
  • “8661”:阻值编码(前三位“866”为有效数字,第四位“1”为倍率10¹,即8.66kΩ);
  • “TS”:精度与温度系数组合标识(对应±1%精度、±100ppm/℃温度系数)。

二、核心性能参数及技术指标

该电阻的关键参数经过严格校准,可满足多数电路的稳定运行需求:

  1. 阻值与精度:额定阻值8.66kΩ,精度±1%(满足分压、信号衰减等电路对阻值偏差的控制);
  2. 功率与电压:额定功率100mW,最大工作电压75V(适配中小功率模块,如传感器接口、电源反馈电路);
  3. 温度特性:温度系数±100ppm/℃(温度每变化1℃,阻值变化约0.01%);工作温度范围-55℃~+155℃(远超常规0603电阻的125℃上限);
  4. 封装与尺寸:0603封装(1.6mm×0.8mm×0.4mm),兼容自动化贴片生产,适合高密度PCB布局。

三、典型应用场景

凭借平衡的性能参数,该电阻广泛应用于以下场景:

  1. 消费电子:手机/平板的音频偏置电阻、智能穿戴的传感器分压电路(低功耗+±1%精度满足小型化需求);
  2. 工业控制:小型PLC的I/O接口电阻、温度传感器信号转换电路(宽温范围应对工业现场高低温波动);
  3. 汽车辅助电路:车载中控按键灯电阻、倒车雷达信号处理电阻(155℃高温适配发动机舱环境);
  4. 通信设备:路由器/交换机的电源滤波电阻、低频射频匹配电阻(0603封装适配高密度PCB);
  5. 电源模块:小功率DC-DC反馈电阻、线性稳压器分压电阻(100mW功率+75V电压覆盖低功率电源需求)。

四、产品核心优势

  1. 宽温适应性:-55℃~+155℃工作范围,可在高温暴晒、低温户外等极端环境下稳定工作;
  2. 稳定温度系数:±100ppm/℃确保阻值随温度变化极小(如155℃时偏差仅约1.3%),保证电路性能一致性;
  3. 精度成本平衡:±1%精度满足常规应用,避免高精度电阻的额外成本,同时100mW功率覆盖中小功率场景;
  4. 高兼容性封装:0603为行业通用规格,适配各类贴片元器件,降低自动化生产难度;
  5. 品牌可靠性:富捷电子采用成熟厚膜工艺(陶瓷基+高温烧结),产品通过高温老化、湿度循环等测试,质量稳定。

五、封装特性与应用注意事项

  1. 封装工艺:陶瓷基厚膜工艺,机械强度高、化学稳定性好,抗冲击与振动能力强;
  2. 可靠性测试:需通过155℃/1000h高温存储、-55℃~155℃/1000次温度循环等测试,测试后性能符合行业标准;
  3. 使用注意:电路电压不超过75V、功率不超过100mW(避免过载损坏);焊接遵循回流焊温度曲线(避免热损伤)。

该产品以“通用型+宽温稳定”为核心卖点,是中小功率电子电路的高性价比选择。

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