Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F7873TS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F7873TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F7873TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 787kΩ
- Electronic Component
- 10
- Electronic Component
- BM0265086329
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F7873TS 产品概述
一、产品简介
FRC0402F7873TS 是 FOJAN（富捷）推出的一款高精度贴片厚膜电阻，封装为 0402（1005 公制，约 1.0 × 0.5 mm）。标称阻值 787kΩ，阻值精度 ±1%，额定功率 62.5 mW，额定工作电压 50 V，温度系数（TCR）为 ±100 ppm/℃，适用温度范围 -55℃ 至 +155℃。该系列以小体积、高精度和良好温漂性能为特点，适合对体积和精度有严格要求的电子产品。
二、主要特性
- 阻值：787 kΩ，公差 ±1%（高精度等级）
- 功率：62.5 mW，适用于微功率电路与精密分压场合
- 工作电压：最大 50 V（请按电路实际条件留余量）
- 温度系数：±100 ppm/℃，温度漂移小，长期稳定性好
- 工作温度：-55℃ ~ +155℃，宽温区可靠工作
- 封装：0402 小体积，适配高密度贴装工艺
- 制程：厚膜工艺，性价比高，制造稳定性好
三、典型应用场景
- 精密分压与阻抗匹配电路（数据采集、传感器前端）
- 移动终端、可穿戴设备及便携仪表中对体积与精度并重的阻值需求
- 通信设备与消费电子产品的微功率偏置、滤波电路
- 工业控制与医疗电子中对温漂和长期稳定性有一定要求的应用
四、可靠性与环境适应性
该型号采用厚膜材料和成熟的贴片工艺，具备良好的抗热循环和潮湿性能，适合常见工业及消费级可靠性要求。额定温度范围覆盖-55℃~+155℃，在温度变化下阻值漂移受 TCR 控制，满足多数精密应用的长期稳定性需求。具体可靠性测试（如热冲击、耐湿性、负载寿命）建议参考厂方详细认证报告或样品验证结果。
五、封装与装配
- 标准 0402 封装，适用于自动贴装机与回流焊工艺
- 常见包装方式为卷盘（Tape & Reel），便于 SMT 线高速贴装
- 推荐在 PCB 设计时遵循 0402 焊盘和间距规范，并注意阻值高时防止漏电或爬电路径
六、焊接与存储建议
- 适配常规无铅回流工艺（为保证性能，建议参考厂方回流温度曲线）
- 存储环境建议干燥、避免强酸强碱及腐蚀性气体，长期保存请防潮包装
- 高阻值器件在高湿环境和表面污损时易出现泄漏，生产与使用时注意清洁 PCB 表面并做好绝缘保护
七、选型与采购注意事项
- 当电路工作电压接近 50 V 或有脉冲电压时，请考虑电压裕量或选择更高工作电压型号
- 若需更低 TCR 或更高功率，可咨询 FOJAN 提供的其它系列或定制选项
- 订购时确认完整料号 FRC0402F7873TS、包装方式及最低订购量，必要时索取样品进行电路兼容性与可靠性验证
如需器件数据手册、回流曲线或可靠性测试报告，我可协助获取或解读，便于在设计与量产中做出最佳选型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
