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FOJAN FRC0402F6200TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F6200TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F6200TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 620Ω
- Electronic Component
- 10
- Electronic Component
- BM0265306455
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F6200TS 贴片厚膜电阻产品概述
一、产品定位与适用场景总览
FRC0402F6200TS是富捷（FOJAN）推出的0402封装厚膜贴片电阻，针对小型化、低功耗、宽温适应性需求设计，兼顾成本与性能平衡，广泛应用于消费电子、可穿戴设备及小型工业电路中，是高密度PCB设计的常用电阻选型方案。
二、核心电气与物理参数说明
该电阻的关键参数明确支撑其应用场景，核心指标如下：
- 阻值与精度：620Ω±1%，精度满足工业级一般要求，阻值一致性较好，可避免电路中因阻值偏差导致的信号偏移或功率损耗异常；
- 功率与电压：额定功率62.5mW，工作电压50V，适配小功率信号调理、分压、限流等低功耗电路；
- 温度特性：温度系数±100ppm/℃，即温度每变化1℃，阻值变化约±0.00062Ω，在-55℃~+155℃宽温范围内阻值稳定性良好；
- 封装尺寸：0402英制封装（对应公制约1.0mm×0.5mm×0.4mm），体积小巧，适配高密度PCB设计。
三、封装与制造工艺特点
采用厚膜工艺制造，核心优势体现在：
- 成本可控：通过丝网印刷将电阻浆料涂覆于陶瓷基底，经高温烧结而成，相比薄膜电阻更适合批量生产，性价比更高；
- 稳定性佳：陶瓷基底耐温性好，厚膜电阻层与基底结合牢固，长期使用阻值漂移率低；
- 环保兼容：适配无铅回流焊工艺，符合RoHS环保要求，满足现代电子制造的环保标准。
四、性能优势与可靠性验证
- 宽温适应性：工作温度覆盖-55℃至+155℃，可满足极端环境（如高温存储、低温户外设备）下的稳定工作；
- 低功耗适配：62.5mW额定功率适配电池供电设备（如可穿戴、低功耗传感器）的能量效率要求；
- 可靠性测试：富捷对该产品完成多项验证，包括：
- 高低温循环测试（-55℃~155℃循环1000次），阻值变化率≤±0.5%；
- 湿度测试（85℃/85%RH环境下1000小时），性能无明显衰减；
满足电子设备长期使用需求。
五、典型应用领域
- 消费电子：智能手机、平板电脑的音频滤波电路、电源分压电路，提升信号纯度与电源稳定性；
- 可穿戴设备：智能手环、手表的传感器信号调理电路（如心率、加速度传感器前置放大），适配小体积PCB；
- 小型工业设备：低功耗工业传感器模块（温度、压力传感器）的限流电路，宽温范围适应工业现场；
- 汽车电子辅助电路：车载低功耗传感器（座椅传感器）的分压电路，155℃高温阈值满足部分车载高温区域需求。
FRC0402F6200TS凭借小巧封装、宽温稳定、高性价比等特点，成为小型化电子设备中电阻选型的实用方案。
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