WMSIC Electronic Components

FOJAN FRC0402F2204TS

ModelFRC0402F2204TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F2204TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F2204TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
2.2MΩ
Electronic Component
10
Electronic Component
BM0265307699
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0402F2204TS 厚膜贴片电阻产品概述

一、产品基本信息

FRC0402F2204TS是FOJAN(富捷)品牌推出的一款常规小功率厚膜贴片电阻,属于FRC系列基础型电阻。型号命名逻辑清晰:

  • “FRC”为厚膜电阻系列标识;
  • “0402”对应英制贴片封装尺寸(1.0mm×0.5mm);
  • “2204”为阻值代码(代表2.2MΩ,即22×10⁴Ω);
  • “TS”后缀对应±1%精度等级。

该型号定位为“小型化、低成本、稳定可靠”的基础电阻,适配绝大多数电子电路的信号调理、偏置、限流等需求。

二、核心性能参数

经标准化测试验证,关键参数如下:

参数项 规格值 说明 阻值 2.2MΩ(2204) 标称阻值,满足中高阻电路设计需求 精度 ±1% 工业级常用精度,覆盖多数常规应用 额定功率 62.5mW 小功率场景适用,避免大电流过载 最大工作电压 50V 实际工作电压不得超过该值,防止击穿 温度系数(TCR) ±100ppm/℃ 温度每变化1℃,阻值漂移±0.01%,稳定性好 工作温度范围 -55℃~+155℃ 工业级宽温,适配车载、户外等极端环境

三、技术特性与优势

  1. 厚膜工艺性价比:采用厚膜印刷+烧结工艺,成本低于薄膜电阻,同时具备抗老化、抗冲击性能;
  2. 小型化适配:0402封装体积仅1.0mm×0.5mm,支持高密度PCB设计,符合电子设备“轻薄化”趋势;
  3. 宽温稳定性:-55~155℃工作范围覆盖汽车电子、工业控制等场景,温度系数适中,高低温下阻值漂移可控;
  4. 环保兼容性:无铅封装符合RoHS 2.0、REACH标准,适配现代SMT自动化生产,焊接良率高;
  5. 批量供应稳定:作为主力型号,产能充足,编带包装适配高速贴装,降低生产损耗。

四、典型应用场景

因体积小、精度适中、宽温可靠,该型号广泛用于:

  1. 消费电子:手机、平板、智能穿戴的信号滤波、偏置电路;
  2. 工业控制:PLC模块、传感器接口的分压、限流电阻;
  3. 汽车电子:车载中控、温度/压力传感器的辅助电路(符合宽温要求);
  4. 通信设备:路由器、基站射频前端的匹配电阻、信号调理电阻;
  5. 医疗仪器:家用血压计、血糖仪的信号处理电路(需稳定低漂移)。

五、可靠性与环境适应性

  1. 抗环境干扰:厚膜结构对湿度、灰尘抗性强,适合户外或工业现场;
  2. 机械可靠性:贴片封装抗振动、抗冲击(可承受10g以上振动),优于插件电阻;
  3. 长期稳定性:经1000小时老化测试,阻值年漂移率≤0.5%,使用寿命≥10年。

六、品牌与质量保障

FOJAN(富捷)是国内专注电阻研发的企业,拥有15年厚膜电阻制造经验,通过ISO9001、IATF16949认证(汽车级)。FRC0402F2204TS批量供应稳定,支持定制化需求(如特殊包装、标识),售后响应及时,可满足不同客户的生产需求。

该型号作为基础型厚膜贴片电阻,平衡了性能、成本与可靠性,是电子设备小型化设计的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.