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FOJAN FRC0402F1072TS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F1072TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F1072TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 10.7kΩ
- Electronic Component
- 10
- Electronic Component
- BM0265086339
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC002F1072TS 贴片厚膜电阻产品概述
一、产品核心定位与应用场景
FRC0402F1072TS是富捷（FOJAN）针对小体积高密度电路、宽温环境稳定需求推出的0402封装厚膜贴片电阻，属于「信号级高精度电阻」范畴，广泛覆盖三大应用领域：
- 消费电子终端：智能手机音频分压、TWS耳机信号调理、智能手环传感器电路（匹配10mm级PCB密度）；
- 工业控制模块：温度传感器信号限流、PLC模拟量输入滤波（±1%精度满足0.1%级信号误差要求）；
- 汽车电子辅助系统：仪表盘背光电路限流、车载蓝牙模块信号匹配（-55℃~+155℃宽温覆盖汽车舱内极端温度）。
其核心定位是「成本与性能平衡型电阻」——既满足多数场景的精度/稳定性需求，又避免薄膜电阻的高成本，适合批量量产的中小功率电路。
二、关键参数详解
该电阻的核心参数围绕「小体积、高精度、宽温稳定」设计，具体如下：
参数项 数值/规格 实际意义 电阻类型 厚膜电阻 采用陶瓷基板+丝网印刷电阻浆料工艺，成本低于薄膜电阻，稳定性优于碳膜电阻 阻值 10.7kΩ 标准E96系列衍生阻值（10.7kΩ≈10.5kΩ×1.02），适配分压/限流精准需求 精度 ±1% 实际阻值范围10.593kΩ~10.807kΩ，满足工业级0.5%信号误差、消费级1%误差要求 额定功率 62.5mW（0402封装典型值） 信号级功率（非功率电阻），适合<10mA电流的信号电路（I=√(P/R)=√(62.5mW/10.7kΩ)≈2.4mA） 最大工作电压 50V（直流/交流有效值） 避免电压击穿，需注意「电压×电流≤功率」（如50V时最大电流≤1.25mA） 温度系数（TCR） ±100ppm/℃ 每变化1℃，阻值变化±100×10⁻⁶，即10.7kΩ每℃变化±1.07Ω，宽温下误差可控 工作温度范围 -55℃~+155℃ 覆盖工业级（-4085℃）、汽车级（-40125℃）扩展需求，极端温度下性能稳定三、封装与工艺特性
3.1 封装尺寸
0402封装（英制代码：04代表长度0.04英寸，02代表宽度0.02英寸；公制尺寸：1.0mm×0.5mm），是目前贴片电阻的主流小封装之一，仅占PCB面积0.5mm²，适合高密度布局（如每平方厘米可容纳2000+颗该电阻）。
3.2 厚膜工艺优势
- 材料体系：采用高稳定性钌基电阻浆料（RuO₂），烧结后形成致密电阻层，抗老化性能优于碳膜；
- ** trimming技术**：通过激光微调阻值，实现±1%精度（普通厚膜电阻仅±5%）；
- 电极结构：三层电极（银钯→镍→锡铅），兼容回流焊/波峰焊，焊接强度符合IPC-J-STD-001标准。
四、性能优势与竞争对比
相比同封装同阻值的其他电阻，FRC0402F1072TS的核心优势：
对比维度 优势点 成本性价比 厚膜工艺成本比薄膜电阻低30%以上，精度±1%满足90%以上信号电路需求 宽温稳定性 ±100ppm/℃ TCR优于多数碳膜电阻（±200ppm/℃），适合-55℃极端低温场景 机械可靠性 0402封装抗振动（10g/50~2000Hz）、冲击（100g/1ms）性能符合MIL-STD-202标准 一致性 批量生产阻值离散度≤0.5%，避免电路批量一致性问题五、选型与应用注意事项
- 功率降额使用：环境温度超过70℃时需降额（如155℃时降额至30%，即最大功率≤18.75mW），避免过热导致阻值漂移；
- 焊接工艺要求：回流焊温度曲线需控制在220~240℃（峰值），时间≤60s，避免0402封装因过热变形；
- 电压限制：严禁超过50V工作电压（如高压电路需并联分压电阻）；
- 场景匹配：不适合大电流（>5mA）、高功率（>62.5mW）或超高温（>155℃）场景（需选择功率电阻或薄膜电阻）。
六、总结
FRC0402F1072TS凭借「小体积高密度、±1%高精度、-55~155℃宽温稳定、高性价比」四大核心特性，成为消费电子、工业控制、汽车电子等领域的信号级电阻首选。其既满足批量量产的成本控制需求，又覆盖多数场景的性能要求，是平衡「尺寸、精度、成本」的典型贴片厚膜电阻方案。
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