Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0603F5602TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0603F5602TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0603F5602TS
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 56kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264525310
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0603F5602TS 厚膜贴片电阻产品概述
一、产品基本信息
FRC0603F5602TS是富捷（FOJAN）推出的一款0603封装厚膜贴片电阻，属于常规高精度被动元器件范畴。型号中“0603”对应英制封装尺寸（0.06英寸×0.03英寸，公制1.6mm×0.8mm），“5602”为阻值代码（56×10²=56kΩ），整体适配SMT自动化贴装工艺，适合批量生产场景。
二、核心性能参数
该电阻的关键性能参数明确，可覆盖多数电路设计需求：
- 阻值与精度：固定阻值56kΩ，精度±1%（满足模拟电路、信号处理对阻值偏差的严格要求）；
- 功率与电压：额定功率100mW（0603封装常规规格），最大工作电压75V（需注意电路电压不超过此阈值）；
- 温度特性：温度系数±100ppm/℃（温度每变化1℃，阻值漂移±0.01%），工作温度范围-55℃~+155℃（宽温适配高低温环境）；
- 封装与工艺：陶瓷基片+厚膜电阻浆料结构，抗冲击、抗振动性能较好，兼容无铅回流焊工艺。
三、典型应用场景
基于参数特点，该电阻广泛应用于以下领域：
- 消费电子：智能手机、智能穿戴（手表/手环）的传感器信号调理电路（滤波、放大），小封装适配设备内部紧凑布局；
- 工业控制：PLC模块、传感器节点（如温度/压力传感器）的辅助电路，宽温范围适应工业现场高低温（如北方户外设备、车间烤箱附近）；
- 通信设备：路由器、交换机的射频前端、电源滤波电路，±1%精度保证信号传输稳定性；
- 智能家居：智能家电（空调、洗衣机）的控制电路，批量贴装效率高，成本可控。
四、品牌与品质保障
富捷（FOJAN）作为国内专注被动元器件的品牌，FRC系列电阻经过严格工艺管控：
- 符合RoHS 2.0、REACH环保标准，无铅无镉，满足出口及环保要求；
- 生产过程中经阻值分选、温度循环测试，保证批量一致性；
- 封装结构抗回流焊热应力，贴装后故障率低，适合长期稳定工作。
五、应用优势
- 小型化集成：0603封装体积小，可减少PCB占用面积30%以上，适配小型化产品设计；
- 精度稳定性：±1%精度+±100ppm/℃温度系数，在温度变化时阻值漂移小，避免电路性能波动；
- 工艺兼容性：厚膜工艺成熟，适配常规SMT贴装、回流焊，生产效率高，降低制造成本；
- 宽温适配：-55℃~+155℃覆盖从低温存储到高温工作场景，无需额外增加温度补偿电路。
FRC0603F5602TS凭借“小封装+高精度+宽温”的平衡优势，成为消费电子、工业控制等领域的高性价比选择，可满足多数常规电路的电阻需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
