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FOJAN FRC1206F2402TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC1206F2402TS
- Type
- FOJAN
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC1206F2402TS
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 24kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264525424
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC1206F2402TS 厚膜贴片电阻产品概述
一、产品定位与典型应用场景
FRC1206F2402TS是富捷电子（FOJAN）推出的1206封装厚膜贴片电阻，主打「中低功率、高精度、宽温域」的平衡设计，覆盖多领域标准化电路需求：
- 消费电子：手机/平板的信号调理、音频滤波、电源分压；
- 工业控制：PLC模拟量I/O模块的电阻网络、传感器信号放大偏置；
- 汽车电子：辅助驾驶传感器（毫米波雷达）预处理、车载中控电源；
- 通信设备：基站射频前端偏置、光模块阻抗匹配。
该产品以高性价比替代部分薄膜电阻，适合批量生产的常规精度电路。
二、关键参数规格详解
核心参数明确支撑应用场景，需重点关注功率-电压耦合约束：
- 阻值与精度：标称24kΩ，±1%精度（符合IEC 60115-1），无需额外校准；
- 功率与电压：额定功率250mW，最大工作电压200V；实际应用需满足：
( V \leq \sqrt{P_{额定} \times R} \approx 77.5V )（因200V下功率达1.67W，远超额定）； - 温度特性：TCR±100ppm/℃（温度每变1℃，阻值变0.01%）；-55℃~+155℃内最大漂移±2.1%；
- 工作温度：覆盖汽车级（-40℃+125℃）、工业级（-40℃+85℃），适应极端环境。
三、封装与工艺优势
1206封装（公制3216，3.2mm×1.6mm）与厚膜工艺是核心竞争力：
- 封装适配性：主流贴片封装，适配自动化贴装，焊盘（2.0mm×1.0mm）兼容性好，节省PCB空间；
- 厚膜工艺特点：丝网印刷+高温烧结制造，成本低于薄膜电阻，稳定性优于碳膜电阻；厚膜层附着力强，短期过载（1.5倍额定功率）不易失效。
四、可靠性与环境适应性
通过多项行业测试，满足严苛场景：
- 长期稳定性：25℃/额定功率下，1000小时老化阻值漂移≤0.5%；
- 耐环境性能：抗湿度（55℃/95%RH×1000h，漂移≤1%）、抗振动（10~2000Hz，无开路/短路）；
- 焊接兼容性：支持回流焊（260℃/10s）、波峰焊（240℃/5s），贴装良率稳定。
五、应用注意事项
为保证性能寿命，需注意3个核心要点：
- 功率降额：实际功率≤200mW（80%额定）；环境温度＞70℃时，每升10℃降额10%；
- 电压限制：工作电压≤77.5V（功率约束下的安全值），避免超压过载；
- 焊接规范：回流焊需符合IPC J-STD-020，焊盘镀锡/镍防氧化，避免虚焊。
总结：FRC1206F2402TS以稳定性能、宽温范围和高性价比，成为消费电子、工业控制、汽车电子等领域的优选元件，适合批量标准化设计。
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