Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC0402F4872TS是FOJAN(富捷)推出的一款0402封装厚膜贴片电阻,针对小型化、低功耗电子设备设计,核心参数为48.7kΩ±1%阻值、62.5mW额定功率,兼顾精度与环境适应性,是各类紧凑电路中的通用选型。
该产品属于厚膜贴片电阻范畴,采用丝网印刷+高温烧结工艺制造,区别于薄膜电阻的高成本、碳膜电阻的低稳定性,平衡了性能与成本。其定位为低功耗高精度小型电阻,适配高密度PCB布局,可替代同类0402封装48.7kΩ阻值产品,覆盖消费电子、工业控制等多领域。
阻值为48.7kΩ±1%,属于E96标准阻值系列(1%精度常用系列),精度满足多数电路的匹配需求——例如信号放大电路中,1%偏差可避免因阻值失配导致的增益误差;电源偏置电路中,可保证电压/电流输出稳定。
额定功率62.5mW(0.0625W),是0402封装的常规低功耗等级。根据P=I²R计算,最大允许电流约1.13mA(I=√(62.5e-3/48.7e3)),实际应用中需留10%-20%余量,避免过热损坏。
最大工作电压50V(直流/交流通用),绝缘层可承受50V电压而不击穿,适合低电压电路(如3.3V、5V系统),若电路电压超过50V需串联或更换更高电压等级电阻。
温度系数为**±100ppm/℃**,表示温度每变化1℃,阻值变化±0.01%。以25℃为基准,在工作温度范围(-55℃~+155℃)内,最大阻值漂移约±1.3%(155℃比25℃高130℃,130×0.01%=1.3%),该漂移量在工业、车载等宽温场景中可接受。
该产品以小型化、低功耗、宽温稳定为核心优势,兼顾成本与性能,是48.7kΩ阻值在紧凑电路中的可靠选型,可满足多领域电子设备的设计需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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