Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOJAN FRC0402F1652TS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOJAN FRC0402F1652TS
- Type
- FOJAN
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- FOJAN
- Electronic Component
- FRC0402F1652TS
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.01g
- Electronic Component
- 16.5kΩ
- Electronic Component
- 10
- Electronic Component
- BM0265139685
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FRC00402F1652TS 厚膜贴片电阻产品概述
一、产品核心定位与应用场景
FRC0402F1652TS是FOJAN（富捷） 推出的0402封装厚膜贴片电阻，针对中小功率精密电路设计需求，兼顾小体积、稳定精度与宽温适应性，广泛适用于消费电子、工业控制、通信终端等领域的信号调理、分压网络、限流保护等场景，是高密度PCB布局的常用元件。
二、关键性能参数解析
1. 阻值与精度
阻值为16.5kΩ（即16500Ω），精度达**±1%**，满足一般精密电路的阻值偏差要求——可避免信号分压、滤波环节的失真，适配对阻值一致性要求较高的电路设计。
2. 功率与电压
额定功率为62.5mW，工作电压上限为50V：在额定条件下可稳定承载低功耗电路的功率需求，电压范围覆盖常见直流/低频交流电路的工作场景，避免过压损坏风险。
3. 温度系数与温宽
温度系数为**±100ppm/℃（即温度每变化1℃，阻值变化约0.01%），工作温度范围为-55℃~+155℃**：宽温适应性覆盖工业级环境要求，在极端温度波动下仍能保持阻值稳定，适合户外设备、车载辅助电路等场景。
三、封装与工艺特性
1. 封装尺寸
采用0402封装（英制尺寸，对应公制1005），具体尺寸约为1.0mm×0.5mm×0.3mm，体积小巧，可显著提升PCB布局密度，适配智能手机、小型传感器等小型化电子设备。
2. 厚膜工艺优势
通过丝网印刷+高温烧结工艺在陶瓷基片上形成电阻膜，兼具成本可控、性能稳定的特点：厚膜结构耐温性优于薄膜电阻，且生产效率高，适合批量应用。
四、可靠性与适配性
1. 环境可靠性
工作温宽覆盖-55℃~+155℃，满足工业级设备的环境要求；厚膜电阻的结构抗机械应力能力较强，配合焊接工艺可降低开路/短路风险，长期可靠性有保障。
2. 生产适配性
支持回流焊、波峰焊等常规贴片焊接工艺，焊接兼容性强；符合RoHS环保标准，满足国内外电子设备的认证要求，可直接用于出口产品设计。
五、品牌与品质保障
由FOJAN（富捷）生产，该品牌作为专业电子元器件制造商，其厚膜电阻产品经过严格的出厂测试（包括阻值精度、功率负载、温漂等项目），可为客户提供稳定的供货周期与技术支持，降低供应链风险。
六、典型应用场景
- 消费电子：智能手机、平板电脑的电源管理电路（分压检测）、信号滤波电路；
- 工业控制：小型PLC、传感器信号调理模块的限流/分压环节；
- 通信终端：路由器、交换机的射频辅助电路、LED指示灯限流；
- 车载辅助电路：车载小功率控制单元（如座椅调节、氛围灯）的电阻元件（需确认具体场景温宽要求）。
该产品以“小体积+稳定精度+宽温适应性”为核心优势，是中小功率精密电路设计的高性价比选择，可满足多数常规电子设备的电阻需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
