WMSIC Electronic Components

FOJAN FRC0402F1R20TS

ModelFRC0402F1R20TS
Package0402
BrandFOJAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOJAN FRC0402F1R20TS
Type
FOJAN
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
FOJAN
Electronic Component
FRC0402F1R20TS
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.01g
Electronic Component
1.2Ω
Electronic Component
10
Electronic Component
BM0265149737
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±400ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FRC0202F1R20TS 贴片厚膜电阻产品概述

一、产品基本信息

FRC0402F1R20TS是富捷电子(FOJAN) 推出的一款0402封装厚膜贴片电阻,专为高密度电子电路设计。型号中:

  • FRC为富捷厚膜电阻系列标识;
  • 0402对应英制封装尺寸(1.0mm×0.5mm,公制1005);
  • 1R20表示标称阻值1.2Ω;
  • TS为精度及封装后缀(对应±1%精度等级)。

产品定位为小体积、高精度、宽温适用的通用型贴片电阻,可满足消费电子、工业控制等多场景的信号调理、限流分压需求。

二、核心性能参数

参数项 具体指标 说明 电阻类型 厚膜贴片电阻 印刷工艺制备,可靠性强 标称阻值 1.2Ω(1R20) 标准阻值系列 阻值精度 ±1% 满足中高精度电路需求 额定功率 62.5mW(25℃) 0402封装典型功率值 额定工作电压 50V(AC/DC通用) 需结合温度降额使用 温度系数(TCR) ±200ppm/℃ 温度变化时阻值漂移可控 工作温度范围 -55℃ ~ +155℃ 覆盖低温存储及高温工作 封装尺寸 0402(1.0×0.5mm) 小型化设计,节省PCB面积

三、设计特点与优势

1. 小体积高密度集成

0402封装体积仅为0603封装的40%左右,可大幅压缩PCB布局空间,适配智能手机、可穿戴设备等对尺寸要求严苛的产品,同时支持高密度贴装(每平方厘米可达数千颗)。

2. 高精度稳定性能

±1%阻值精度满足信号校准、分压网络、限流电路等场景的精准度需求;±200ppm/℃的TCR确保温度从-55℃升至155℃时,阻值最大漂移仅约0.48%,宽温环境下性能稳定。

3. 厚膜工艺可靠性

采用厚膜印刷+烧结工艺,电阻膜层与陶瓷基底附着力强,耐机械应力、环境腐蚀及长期老化,1000小时高温负荷测试后阻值漂移≤0.5%,寿命符合工业级标准。

4. 宽温适用免额外散热

-55℃至+155℃的工作温度覆盖了大多数电子设备的使用场景(如汽车低温启动、工业设备高温车间),无需额外散热设计,降低系统成本。

5. 兼容主流生产工艺

封装尺寸符合IEC 60115-1国际标准,可兼容全自动SMT贴装设备(贴装精度≤±0.05mm),焊接兼容性好,生产效率高。

四、典型应用场景

1. 消费电子领域

  • 智能手机/平板:电源管理模块(电池充放电限流)、音频电路(信号匹配电阻)、可穿戴设备(心率传感器信号调理);
  • 小型家电:智能手表充电底座、蓝牙耳机充电盒(过流保护电路)。

2. 工业控制设备

  • 小型PLC(模拟量输入输出模块的分压网络);
  • 传感器信号调理:温度/压力传感器的信号放大前级限流。

3. 通信设备

  • 5G小基站:射频前端低功率信号匹配;
  • 光纤收发器:光模块偏置电路限流。

4. 汽车电子(辅助系统)

  • 车载信息娱乐系统:按键电路分压、后视镜调节电路限流(需按汽车级标准降额使用)。

五、使用注意事项

1. 功率降额要求

额定功率62.5mW为25℃环境值,实际使用需按温度降额:

  • 70℃时降额至50mW(80%);
  • 125℃时降额至30mW(48%);
  • 155℃时降额至20mW(32%)。

2. 焊接工艺规范

  • 回流焊:峰值温度≤260℃(持续时间≤10秒);
  • 手工焊:烙铁温度≤350℃(焊接时间≤3秒);
  • 避免多次焊接,防止膜层损坏。

3. 静电防护

厚膜电阻抗静电能力优于薄膜,但仍需遵循ESD规范:

  • 人体模型(HBM)≤2kV;
  • 生产/测试时佩戴防静电手环及接地设备。

4. 存储条件

未开封产品存储于15-35℃、湿度40-60% 环境,开封后建议12个月内使用完毕;避免吸潮(吸潮后需120℃烘烤4小时)。

总结

FRC0402F1R20TS凭借小体积、高精度、宽温稳定的核心优势,成为高密度电子电路设计的理想选择,广泛覆盖消费电子、工业控制、通信等多领域,可有效降低系统尺寸及成本,提升产品可靠性。

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