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FOSAN SS56
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN SS56
- Type
- FOSAN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- SS56
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.116g
- Electronic Component
- 1
- Electronic Component
- BM0228561512
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 100uA@60V
- (Vf)
- 700mV@5A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS56 (FOSAN 富信) — SMA 封装肖特基二极管 产品概述
一、产品简介
SS56 为 FOSAN（富信）制造的高可靠性肖特基整流二极管，采用 SMA（DO‑214AA）封装，适合中等功率整流与保护应用。器件以低正向压降、高浪涌承受能力和宽工作结温著称，适用于要求高效率与快速开关的电源与保护电路。
二、主要参数与特性
- 正向压降 (Vf)：典型值 700 mV @ 5 A，低压降有助于减少导通损耗与发热。
- 直流反向耐压 (Vr)：60 V，适合 12 V/24 V 等常见汽车与工业总线。
- 连续整流电流：5 A（可在合适散热条件下长期工作）。
- 反向电流 (Ir)：100 μA @ 60 V，肖特基特性导致在高温或高压下漏电相对偏高，需在设计时评估。
- 非重复峰值浪涌电流 (Ifsm)：120 A（瞬态，常用于描述一次性浪涌承受能力，如启动浪涌或短路事件）。
- 工作结温范围：-65 ℃ ～ +150 ℃，适合严苛温度环境。
- 封装：SMA（体积小、便于自动贴装与波峰/回流焊）。
三、产品优势与设计考量
- 优势：低 Vf 降低功率损耗，提高整机效率；无明显反向恢复，适合开关电源和快恢复场合；SMA 小尺寸、成本低。
- 设计考量：肖特基在高温或高逆压下漏电流增加（本器件 100 μA @ 60 V），在高温、低电流精密电路中需评估影响；长时间大电流工作需良好散热与足够铜箔面积。
四、典型应用场景
- 开关电源输出整流与续流二极管（降压/升压转换器）。
- 12 V/24 V 汽车电源整流、反向极性保护与电流旁路。
- 电池管理、充电器、功率模块和电机驱动的保护与整流。
- 高频快切换电路中的回流二极管。
五、使用与布局建议
- 尽量增加焊盘铜面积和热沉，减小结-周围温升以维持额定 5 A 连续电流。
- 对于有较大浪涌的场合，确认 Ifsm 120 A 的脉冲条件与实际浪涌持续时间是否匹配。
- 在高逆压/高温条件下考虑加并联或选择更低漏电的器件，避免对系统静态功耗造成影响。
- 焊接遵循封装热规范与 PCB 工艺（推荐按 IPC/JEDEC 导则），避免过高回流温度或过长高温暴露。
六、封装与订购信息
- 封装：SMA（适用于自动贴装与回流焊）。
- 品牌：FOSAN（富信）。
- 型号关键词：SS56，60 V，5 A，SMA。
若需获取完整电气特性曲线、热阻 RθJA、封装尺寸与焊接工艺规范，请索取富信完整数据手册以便做精确热设计与可靠性评估。
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