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FOSAN SS310
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN SS310
- Type
- FOSAN
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- SS310
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0228561501
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 20uA@100V
- (Vf)
- 850mV@3A
- Electronic Component
- 65℃~+130℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS310（FOSAN 富信）产品概述
一、特性概述
SS310 是一款面向中功率整流和保护应用的肖特基二极管，品牌为 FOSAN（富信），封装为 SMA。该器件在高电压与大电流条件下仍能维持较低正向压降与极小反向漏电，适合开关电源的输出整流、反向保护、续流保护与电池充放电路径设计。
二、电气参数
- 直流正向电流（整流电流）：3A（许可连续电流，需参考热管理条件）
- 正向压降（Vf）：0.85V @ If = 3A（典型条件）
- 最大反向电压（Vr）：100V
- 反向漏电流（Ir）：20µA @ Vr = 100V
- 非重复峰值冲击电流（Ifsm）：80A（一次性浪涌能力，用于浪涌吸收与启动瞬态）
- 结温工作范围：-65℃ ~ +130℃
注：Vf 在高电流下产生的功耗应纳入设计计算（在 If=3A 时瞬时损耗约 P = Vf·I ≈ 2.55W）。
三、热性能与封装
SMA 小外形封装体积小、热阻相对较高，器件在持续 3A 工作时对 PCB 铜箔面积和散热路径要求较严格。建议：
- 增大焊盘铜面积并采用多层过孔或散热过孔（thermal vias）将热量传导至底层或散热层；
- 在长时间大电流场景下对正向压降带来的功耗进行热仿真与实际测温验证；
- 注意封装的焊接可靠性，生产时遵循厂商给出的焊接与回流工艺规范（详见原厂 Datasheet）。
四、典型应用
- 开关电源二次侧整流；
- 逆向保护与防反接电路；
- 电动车、电池管理系统中的续流二极管；
- 适配器、充电器、车用电子与工业电源等要求 100V 级耐压与 3A 连续电流的场合。
五、PCB 布局与可靠性建议
- 将二极管放置在热源附近并确保良好铜箔散热；为减少局部热点，尽量避免将器件紧邻热敏元件；
- 对于频繁出现大电流浪涌的应用，校核 Ifsm 参数并考虑添加浪涌限制元件（限流、NTC 或 TVS）；
- 在高温或高压工作环境中关注反向漏电随温度上升的变化，必要时进行温度下的 IR 测试；
- 存储与焊接时遵守湿敏与回流曲线要求，避免焊接应力导致封装裂纹或焊点失效（具体参数请参见 FOSAN 数据手册）。
六、采购与替代方案
产品标识为 SS310，品牌 FOSAN（富信），封装 SMA。采购时请确认完整型号与批次并索取最新 Datasheet 以获取详细电气特性与焊接规范。若需替代，选型时应匹配关键参数：Vr≥100V、If(平均)≥3A、Ifsm 足够、在目标 If 下 Vf 与 Ir 相近或更优。最终选型应通过实际样机测试验证满足系统要求。
如需我帮忙整理 PDF 数据手册重点参数或给出 PCB 布局示意与散热建议，请提供目标工况（最大平均电流、环境温度、铜箔厚度等）。
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