WMSIC Electronic Components

FOSAN ES1J

ModelES1J
PackageSMA
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN ES1J
Type
FOSAN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
ES1J
Electronic Component
1
Package
SMA
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0264881631
Current
1A
Current(Ir)
5uA@600V
(Vf)
1.7V@1A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000
Voltage Rating(Vr)
600V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES1J快恢复二极管产品概述

一、产品核心定位

ES1J是FOSAN(富信)推出的快恢复/高效率整流二极管,采用SMA表面贴装封装,针对中高压、高频整流场景设计,兼顾导通效率、反向恢复速度与环境适应性,可满足开关电源、逆变器等领域的实用需求。

二、关键参数解析

ES1J的核心参数直接体现其性能优势,具体解析如下:

(1)整流与耐压能力

  • 直流反向耐压(Vr):600V,覆盖多数中高压电源的反向电压需求;
  • 持续整流电流(If):1A,满足常规小功率整流场景的持续负载能力;
  • 反向漏电流(Ir):5μA@600V,漏电流极低,可有效减少反向损耗,提升电源整体效率。

(2)正向压降与效率

正向压降(Vf)为1.7V@1A,相比部分同耐压等级快恢复二极管更低,可降低持续负载下的导通损耗,尤其适合对效率有要求的电源设计。

(3)反向恢复特性

反向恢复时间(Trr)为35ns,属于快恢复二极管范畴,能显著减少高频开关过程中的反向恢复损耗,适配工作频率较高的电路(如开关电源次级整流)。

(4)温度与浪涌适应性

  • 工作结温范围:-65℃~+150℃,覆盖工业级高低温环境(如户外通信设备、工业控制电源);
  • 非重复峰值浪涌电流(Ifsm):30A,可承受突发电流冲击(如电源开机瞬间、负载突变),提升器件可靠性。

三、封装与可靠性设计

ES1J采用SMA封装(表面贴装型,尺寸紧凑),具有以下优势:

  1. 体积小:适合高密度PCB设计,满足小型化电子设备(如便携式电源、小型家电)的空间需求;
  2. 散热性:封装结构可有效传导结温,配合宽结温范围,保证长期稳定工作;
  3. 品牌可靠性:FOSAN作为专业元器件厂商,ES1J的参数一致性与长期稳定性经过验证,可降低终端产品的失效风险。

四、典型应用场景

ES1J的性能特点使其适用于多种中高压高频整流场景,核心应用包括:

  1. 开关电源:次级整流环节,快恢复特性减少开关损耗,提升电源效率;
  2. 逆变器:太阳能发电、UPS电源等场景的中高压整流,600V耐压满足逆变输出需求;
  3. 工业控制电源:宽结温范围适应工业现场的高低温变化,低漏电流保证电源稳定性;
  4. 通信设备电源:基站、路由器等设备的辅助电源整流,稳定可靠;
  5. 小型家电:如充电器、小家电控制板,浪涌能力抗开机冲击,效率满足节能需求。

五、性能优势总结

ES1J的核心优势可概括为:

  • 效率兼顾高频:低正向压降+35ns快恢复,平衡导通与开关损耗;
  • 宽温高可靠:-65℃~+150℃结温+30A浪涌,适应恶劣环境;
  • 紧凑易集成:SMA封装适合小型化设计,表面贴装便于自动化生产;
  • 成本可控:性能满足多数实用场景,性价比突出。

该器件凭借均衡的性能与可靠性,成为中高压高频整流领域的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.