WMSIC Electronic Components

FOSAN SS210

ModelSS210
PackageSMA
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN SS210
Type
FOSAN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
SS210
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.12g
Electronic Component
1
Electronic Component
BM0264886326
Current
2A
Diode
1
Current(Ir)
20uA@100V
(Vf)
850mV@2A
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS210肖特基二极管产品概述

一、产品核心身份与定位

SS210是FOSAN(富信)品牌推出的SMA封装肖特基势垒整流二极管,属于中低功率整流器件范畴,核心规格为2A直流连续整流电流、100V直流反向耐压。凭借肖特基二极管特有的低正向压降优势,它广泛适配对效率、体积有严格要求的电子电路,是消费类电子、小型电源、汽车辅助电路的常用器件。

二、关键电气性能参数

SS210的核心参数直接决定其应用适配性,具体如下:

  1. 正向压降(Vf):850mV@2A——肖特基二极管区别于普通硅整流管的核心优势,低正向压降可显著降低导通损耗(例如在开关电源中,能减少发热、延长设备寿命);
  2. 直流反向耐压(Vr):100V——满足多数中低电压电路的反向保护需求,覆盖12V、24V、48V等常见系统;
  3. 直流整流电流(If):2A——连续工作时可稳定承载2A电流,适配小型开关电源、LED驱动等低功率负载;
  4. 反向漏电流(Ir):20μA@100V——低漏电流设计减少反向损耗,高温环境下仍能保持低功耗,提升长期可靠性;
  5. 非重复峰值浪涌电流(Ifsm):50A——可承受瞬间50A浪涌冲击(持续8.3ms),有效应对电源插拔、负载突变等场景;
  6. 工作结温范围:-65℃~+150℃——宽温度适应能力,覆盖工业环境(如汽车舱内、户外设备)及消费类电子的极端温度需求。

三、封装与物理特性

SS210采用SMA封装(DO-214AC),是一款小型化贴片封装:

  • 尺寸紧凑(典型3.8mm×2.0mm×1.5mm),节省PCB空间,适配便携式设备(如手机充电器、智能穿戴)的小型化设计;
  • 贴片结构适配自动化贴装生产线,提高生产效率,降低人工成本;
  • 封装材料具备良好耐热性与密封性,保护芯片免受湿度、灰尘等环境因素影响。

四、典型应用场景

SS210的参数特性使其适配以下主流场景:

  1. 小型开关电源:手机、平板、笔记本充电器中,低Vf降低导通损耗,提升电源转换效率;
  2. LED驱动电路:作为续流二极管,避免LED反向击穿,低Vf不额外增加正向压降,确保亮度稳定;
  3. DC-DC转换器:降压/升压模块的续流管,低损耗提升模块效率,适配<50W低功率转换;
  4. 汽车电子辅助电路:车载充电器、传感器供电电路,宽温范围适应汽车舱内及发动机舱温度变化;
  5. 消费类电子保护:移动电源、蓝牙耳机的电源输入电路,50A浪涌能力应对插拔时的瞬间电流冲击。

五、可靠性与品质保障

FOSAN(富信)作为专业半导体制造商,SS210经过严格工艺与测试:

  • 芯片采用优质肖特基材料,确保批次间Vf、Ir参数一致性;
  • 封装符合RoHS环保标准,无铅无镉,适配绿色电子设备需求;
  • 出厂前经高低温循环、浪涌冲击等可靠性测试,满足工业级应用的长期稳定性要求。

SS210凭借“低损耗、小体积、宽温适应”的核心优势,成为中低功率整流/续流场景的高性价比选择,可满足批量生产与定制化应用需求。

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