Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOSAN BZT52C5V1
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C5V1
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C5V1
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzt)
- 425Ω
- Electronic Component
- BM0228561517
- Diode
- 1
- Current(Ir)
- 2uA@2V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 4.8V~5.4V
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C5V1 产品概述
一、产品简介
BZT52C5V1 是 FOSAN（富信）推出的一款独立式稳压二极管，标称稳压值 5.1V，采用 SOD-123 小封装，面向空间受限的低功耗稳压和浪涌夹持应用。器件设计简单可靠，便于表面贴装（SMT）生产线集成。
二、主要特性
- 稳压值（标称）：5.1V，实际允许范围 4.8V ~ 5.4V。
- 最大耗散功率 Pd：500mW（在额定条件下）。
- 反向电流 Ir：2µA @ 2V，低漏洩利于低功耗设计。
- 稳压阻抗 Zzt：425Ω，在小电流工作点下具有良好稳压特性。
- 工作结温范围：-65℃ ~ +150℃，适应工业级温度需求。
- 封装：SOD-123，便于自动贴装与回流焊工艺。
三、电气与热特性说明
该器件为独立式稳压二极管，典型工作是在反向偏置区作为电压基准或过压保护元件使用。Zener 阻抗较大，适合在小电流或噪声容忍度不高的应用中作为简易稳压源。Pd 为 500mW，SOD-123 封装的散热能力有限，实际使用时需考虑功率降额与环境温度对耗散能力的影响，以避免结温超过额定范围。
四、典型应用
- 小电流参考电压源与偏置电路。
- 信号线或电源线的过压钳位保护。
- 便携设备、仪表及消费电子中对 5.1V 容忍范围的电压钳位。
- 嵌入式系统的瞬态抑制（在额定能量范围内）。
五、选型与使用建议
- 若电路需要更低噪声或更精准稳压，请选用阻抗更低或功率更大的参考源。
- 使用时应计算最大反向电流与功耗：实际耗散 Pd = Vr * Ir_total（含通过二极管的工作电流及漏电），并预留安全裕度。
- 对散热敏感的应用建议在 PCB 上增加铜箔或热沉，或选择功率更高的封装型号。
- 焊接与回流工艺请按供应商数据手册执行，以避免热应力影响可靠性。
六、封装与可靠性
SOD-123 封装兼顾体积与装配效率，适合自动化贴装。工作结温范围宽，适合工业环境，但长时间接近上限温度会降低器件寿命。出货与储存应注意防潮防静电，具体可靠度与寿命数据请参照 FOSAN 原厂规格书。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
