WMSIC Electronic Components

FOSAN BZT52C18

ModelBZT52C18
PackageSOD-123
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C18
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C18
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0228561509
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
16.8V~19.1V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C18(FOSAN 富信)产品概述

一、概述

BZT52C18 是一款独立式小功率稳压二极管,标称稳压值 18V,适用于表贴 SOD-123 封装的电路中。该器件定位为低功耗、低漏电的稳压参考与过压保护元件,凭借紧凑封装和宽温度范围,适合消费电子、通信和工业控制等多种场景的局部稳压与钳位保护。

二、主要参数

  • 稳压值(标称):18V
  • 稳压值范围:16.8V ~ 19.1V(出厂样本范围)
  • 反向漏电流 Ir:50 nA @ 12.6 V(低漏电,利于高阻抗电路)
  • 最大耗散功率 Pd:500 mW(在规定散热条件下)
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 封装:SOD-123(表面贴装)
  • 品牌:FOSAN(富信)
  • 型号:BZT52C18

三、产品特点

  • 稳压值接近 18V,输出稳定,适合作为中低电压参考源。
  • 低反向电流(50 nA @12.6V)利于高阻抗、低功耗电路,减小偏置误差。
  • 小型 SOD-123 封装,便于自动化贴装和高密度 PCB 设计。
  • 宽工作结温(-65~+150 ℃),适应较恶劣环境下的温度变化。
  • 500 mW 功耗额定,对于局部稳压与短时钳位保护满足轻负载需求。

四、典型应用

  • 小功率线性稳压或参考电压源(例如给模拟电路、比较器提供基准)。
  • 输入端或信号线的过压钳位与浪涌吸收。
  • 供电系统的监测与保护电路。
  • 便携式设备与低功耗电子产品中作为简单稳压元件。

五、实用设计与选型建议

  • 最大允许电流估算:Iz_max ≈ Pd / Vz = 0.5W / 18V ≈ 27.8 mA。为保证可靠性与寿命,推荐工作电流留有裕度,常用 1~10 mA 范围更安全。
  • 串联限流电阻计算举例:若输入 Vin = 24V,目标 Iz = 5 mA,则 R = (24 − 18) / 5 mA = 1.2 kΩ;二极管功耗 Pd = 18V × 5 mA = 90 mW(远低于 500 mW 额定)。
  • 注意热耗散与降额:SOD-123 为小型封装,热阻相对较大,实际允许耗散受 PCB 铜箔、焊盘尺寸与环境温度影响。高环境温下应适当降低工作电流或改善散热。
  • 漏电流特性:标注 50 nA @12.6V 表明在较低偏压下漏电极小,适用于对漏电敏感的场合;但在接近或者超过稳压点时应参考完整 Datasheet 的 Iz-Vz 曲线与温度漂移参数以精确设计。

六、封装与可靠性注意事项

  • SOD-123 表面贴装,焊接时遵循厂家回流温度曲线以避免器件过热。
  • 设计 PCB 时扩大焊盘及增加铜箔面积有助于降低结温并提高功率承载能力。
  • 选型时请参考 FOSAN 官方 Datasheet,确认温漂、动态电阻、测试电流 Iz(Vz 测试点)、最大瞬态电流等完整参数,以满足精度和可靠性需求。

总结:BZT52C18(FOSAN)是一款适合小功率稳压与保护用途的 18V 稳压二极管,凭借低漏电、紧凑表贴封装和宽温度范围,能够在众多需要稳定参考电压或限压保护的应用中发挥作用。选型与设计时应结合实际电流、散热条件与电路精度要求进行合理安排。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.