WMSIC Electronic Components

FOSAN 1SS181

Model1SS181
PackageSOT-23
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN 1SS181
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
1SS181
Electronic Component
1
Package
SOT-23
Electronic Component
Switch Diode
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264886291
Current
200mA
Diode
1
Current(Ir)
500nA@80V
(Vf)
1.25V@150mA
Power Dissipation(Pd)
225mW
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS181开关二极管产品概述

一、产品基本信息

1SS181是FOSAN(富信)推出的高速开关二极管,采用1对共阳极配置,封装形式为SOT-23(3引脚小型表面贴装封装)。该器件专为高频、脉冲及逻辑电路设计,兼顾小体积与高性能,适用于多种电子设备的信号处理与保护场景。

二、核心电性能参数详解

1SS181的关键参数直接决定其应用适配性,核心指标如下:

  • 正向压降(Vf):1.25V(典型值,测试条件:IF=150mA)——低导通压降可减少功率损耗,提升电路效率;
  • 直流反向耐压(Vr):80V(最大值)——满足一般电路的反向耐压需求,避免反向击穿;
  • 正向整流电流(IF):200mA(最大值)——可稳定承载200mA直流电流,适配中等功率场景;
  • 耗散功率(Pd):225mW(最大值)——额定工作条件下的最大功耗,需结合散热设计使用;
  • 反向漏电流(Ir):500nA(典型值,测试条件:VR=80V)——低漏电流降低静态功耗,提升电路稳定性;
  • 反向恢复时间(Trr):4ns(典型值)——高速反向恢复是核心优势,可支持MHz级高频切换;
  • 工作结温范围(Tj):-55℃~+150℃——宽温度覆盖工业级环境(如车载、户外设备),可靠性更高。

三、封装与引脚配置

1SS181采用SOT-23封装,尺寸紧凑(典型:长2.9mm×宽1.6mm×高1.1mm),适配高密度PCB设计。
引脚为3引脚共阳极:两个二极管的阳极共用一个引脚,另外两个引脚分别为二极管阴极(具体引脚功能需参考FOSAN官方 datasheet,使用前需核对)。

四、典型应用场景

1SS181的高速特性与小体积使其适用于以下场景:

  1. 高速逻辑电路:作为钳位二极管,抑制逻辑电平过冲,保护后续器件;
  2. 射频(RF)电路:用于信号开关、调制解调模块,低损耗不影响信号完整性;
  3. 脉冲整形电路:快速切换实现脉冲上升/下降沿整形,提升信号质量;
  4. 电源过压保护:反向耐压80V可抑制瞬态过压,保护负载电路;
  5. 通信设备:如WLAN、蓝牙模块等高频电路的信号路径切换。

五、产品优势与特点

1SS181在同类器件中具有以下突出优势:

  • 高速切换:4ns反向恢复时间,支持MHz级高频应用;
  • 低损耗:1.25V正向压降,减少导通功率损耗;
  • 小型化:SOT-23封装节省PCB空间,适配便携式设备(手机、可穿戴);
  • 宽温可靠:-55℃~+150℃结温范围,满足工业与车载环境需求;
  • 高稳定:500nA低反向漏电流,长期工作性能稳定。

六、使用注意事项

为确保器件可靠性,需注意:

  1. 结温不得超过150℃,需根据功耗设计散热路径;
  2. 反向电压不超过80V,避免反向击穿;
  3. 正向电流不超过200mA(直流),脉冲电流参考datasheet额定值;
  4. 焊接遵循SOT-23规范(回流焊温度≤260℃,时间≤30秒);
  5. 存储环境干燥,避免引脚氧化。

1SS181凭借高速、小体积、宽温等特性,成为高速电子电路中信号处理与保护的理想选择,适配多种消费电子、工业与通信设备。

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