WMSIC Electronic Components

FOSAN SS110

ModelSS110
PackageSMA
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN SS110
Type
FOSAN
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
SS110
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.121g
Electronic Component
1
Electronic Component
BM0264886264
Current
1A
Diode
1
Current(Ir)
200uA@100V
(Vf)
850mV@1A
Electronic Component
Electronic Component
Electronic Component
5000
Voltage Rating(Vr)
100V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS110肖特基二极管产品概述

一、核心参数深度解析

SS110是一款中低压肖特基整流二极管,核心参数直接决定了其应用场景的适配性:

  • 正向压降(Vf):850mV@1A:肖特基二极管的核心优势——低正向压降,意味着1A持续电流下管压降仅0.85V,比普通硅整流管(如1N4001)低约15%,能有效减少整流损耗,提升设备效率。
  • 直流反向耐压(Vr):100V:满足大多数中低压(≤100V)应用的反向耐压需求,避免设备因反向电压击穿损坏。
  • 额定整流电流(If):1A:持续工作可耐受的最大正向电流,适配小功率至中功率电子设备的整流设计。
  • 反向漏电流(Ir):200uA@100V:漏电流远低于普通硅管(通常mA级),进一步降低待机功耗,提升电路效率。
  • 非重复峰值浪涌电流(Ifsm):30A:可承受单次瞬间大电流冲击(如开机时电容充电浪涌),提升设备抗干扰能力,减少浪涌损坏风险。

二、封装与品牌背景

  • 封装:SMA(DO-214AC)+28MIL芯片:表面贴装设计,体积小巧(约2.5×3.5×1.0mm),适合高密度PCB布局;28MIL芯片尺寸保证了电流承载能力,平衡了小体积与性能。
  • 品牌:FOSAN(富信):国内专业半导体厂商,拥有10+年肖特基二极管研发生产经验,产品通过RoHS、REACH环保认证,在消费电子、工业控制领域口碑稳定,供货能力强。

三、典型应用场景

SS110凭借低损耗、快开关特性,适配多场景需求:

  1. 开关电源整流:手机充电器、LED驱动电源、小型适配器等,低VF减少电源损耗,提升转换效率(如10W充电器可降低约0.15W损耗);
  2. 续流二极管:电机驱动、DC-DC转换器等电感电路中,肖特基无反向恢复时间(<10ns),可快速续流,避免电感反向电压损坏MOS管;
  3. 反向保护电路:蓝牙耳机、智能手环等电池供电设备,防止电池反接时击穿电路;
  4. 小型家电控制:加湿器、智能插座、小型家电的整流模块,满足小功率电路的可靠性需求。

四、性能优势与竞品对比

  • ** vs 普通硅整流管(1N4001)**:①VF低23%(0.85V vs 1.1V@1A);②无反向恢复时间(硅管>50ns);③体积小30%(SMA vs DO-41);
  • ** vs 外资同规格竞品**:①Ir低33%(200uA vs 300uA@100V);②浪涌能力强20%(30A vs 25A);③性价比高25%,适合批量采购。

五、使用注意事项

  1. 耐压限制:实际反向电压不得超过100V,避免击穿;
  2. 浪涌控制:30A为单次<1ms的非重复浪涌,不可持续或多次冲击,需配合保险丝;
  3. 散热设计:持续1A工作时,SMA封装热阻约100℃/W,环境温度>60℃需增加PCB铜箔面积;
  4. 焊接规范:回流焊温度≤260℃(≤10s),手工焊≤350℃(≤3s),避免热损伤芯片。

SS110以“低损耗+高可靠性+小体积”为核心,是中低压小功率电路的理想选择,广泛适配消费电子、工业控制等领域的量产需求。

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