WMSIC Electronic Components

FOSAN BZT52C10S

ModelBZT52C10S
PackageSOD-323
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C10S
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C10S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.026g
Electronic Component
1
(Zzt)
40Ω
Electronic Component
BM0264886314
Diode
1
Current(Ir)
200nA@7V
Power Dissipation(Pd)
200mW
Electronic Component
9.4V~10.6V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C10S 产品概述

一、主要参数与性能

BZT52C10S 为独立式稳压二极管(Zener),由 FOSAN(富信)生产,采用 SOD-323 小体积封装。主要参数如下:

  • 标称稳压值(Vz):10V(典型范围 9.4V ~ 10.6V)
  • 反向电流(Ir):200nA @ 7V(典型/最大值,表示在未进入稳压区域时的漏电特性)
  • 稳压阻抗(Zzt):40Ω(表征在稳压区的小信号动态阻抗)
  • 最大耗散功率(Pd):200mW(封装与环境条件下的最大结耗散)
  • 工作结温范围(Tj):-65℃ ~ +150℃
  • 单位:1个独立式二极管,封装 SOD-323

二、典型特性与工程计算

  • 最大稳压电流估算:Iz_max ≈ Pd / Vz = 200mW / 10V = 20mA。在设计中通常远低于该值以保证长期可靠性。
  • 动态响应:稳压阻抗 Zzt = 40Ω,表示电流变化 ΔI 将引起电压变化 ΔV ≈ Zzt × ΔI。例如 ΔI = 1mA 时 ΔV ≈ 40mV。
  • 漏电说明:在低于稳压临界电压时,反向漏电可达数百纳安,适合低功耗偏置与基线参考场合。

示例电路计算(稳压器用法):当输入 Vin = 12V,希望在稳压二极管上工作电流 Iz = 5mA,则限流电阻 R = (Vin - Vz) / Iz = (12V - 10V) / 5mA = 400Ω。二极管功耗 Pd_diode ≈ Vz × Iz = 10V × 5mA = 50mW,低于最大耗散。

三、封装与热管理

SOD-323 为表面贴装微型封装,封装体积小、适合高密度 PCB 布局,但散热能力有限。实际应用中应注意:

  • 在 PCB 设计上增大铜箔面积或使用散热焊盘以改善热阻;
  • 避免长期接近最大 Pd 工作,建议在高温环境中对耗散功率进行降额;
  • 焊接与回流工艺应遵循厂商推荐,防止过热损伤器件。

四、典型应用场景与电路示例

  • 稳压基准与电压箝位:为小电流电路提供稳定的参考电压或过压保护;
  • 逻辑偏置与基极偏置电路:在放大器偏置、基准电压源中常见;
  • 测试与仪器中作为温补或温度不敏感的10V参考(需注意温度系数);
  • 简单浪涌/瞬态钳位(非替代 TVS 的强浪涌保护)。

五、选型与使用建议

  • 若工作电流接近或超过几十毫安,应选择更大功率封装或功率更高的稳压器件;
  • 在有噪声或纹波的电源环境中,需考虑稳压阻抗对输出抑制能力的影响,可并联滤波电容减少瞬态电压尖峰;
  • 存储与使用注意静电防护(ESD),遵循封装和回流焊温度限制;
  • 订购时确认供应商型号、批次及封装标识,必要时索取完整数据手册以获取测试电流、温度系数和典型曲线。

BZT52C10S 以其小体积、稳定的 10V 输出与低漏电特性,适用于低功耗、小空间的参考与钳位应用,但在热管理与长期可靠性设计上需充分考虑封装耗散能力与工作环境。

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