WMSIC Electronic Components

FOSAN BZT52C6V2

ModelBZT52C6V2
PackageSOD-123
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C6V2
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C6V2
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264886508
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
5.8V~6.6V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C6V2 产品概述

一、概述

BZT52C6V2 是一款由 FOSAN(富信)提供的独立式稳压二极管,标称稳压值为 6.2V,耗散功率 500mW,封装为 SOD-123。该器件针对小功率稳压、限制过压和信号钳位等应用进行优化,具备宽温度范围和较低的反向漏电流,适用于便携设备与分立电路的电压基准或保护电路。

二、主要技术参数

  • 稳压值(标称):6.2V
  • 稳压值范围:5.8V ~ 6.6V
  • 反向电流 Ir:3 μA @ 2.5V
  • 耗散功率 Pd:500 mW(在规定散热条件下)
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 二极管配置:单颗独立式
  • 封装:SOD-123

三、性能要点解读

  • 稳压精度:器件给出范围 5.8–6.6V,表明在不同批次和温度下输出稳压有一定漂移,选择时若需更高精度应考虑配对或使用外部调整电路。
  • 低漏电:在低电压偏置下的反向电流仅为微安量级,有利于高阻抗或电池供电电路的低功耗设计。
  • 功率与温度:500mW 是在理想散热条件下的最大耗散,实际使用需根据PCB热阻和环境温度进行降额处理,以免超温影响可靠性。

四、封装与热管理

SOD-123 为小型表贴封装,占板面小但热阻相对较高。设计时应注意:

  • 在稳压或钳位工作频繁耗散功率时,通过加大铜箔、使用散热过孔或热平面来降低结温;
  • 在高环境温度下按厂商建议进行功率降额,保证结温不超过最大额定值。

五、典型应用场景

  • 开关电源或线性稳压器的参考电压源与基准钳位;
  • 信号线或供电线的瞬态过压保护与抑制;
  • 便携式和消费电子产品中的局部稳压与偏置电路;
  • 工业控制及汽车低功耗辅助电路(需按温度和寿命评估)。

六、使用与选型建议

  • 对于要求长期稳定或低噪声基准的场合,建议在电路中并联滤波和温度补偿措施;
  • 计算实际结温时应将封装热阻、PCB散热能力和环境温度综合考虑,必要时对 Pd 进行降额;
  • 焊接时遵循 SOD-123 的焊接温度曲线,避免过热导致封装或电性能退化;
  • 采购时确认生产批次与规格书,以确保稳压范围和漏流满足设计要求。

七、包装与型号

型号:BZT52C6V2;品牌:FOSAN(富信);封装:SOD-123。适合SMT贴片生产工艺,适配常见贴片料带包装,便于批量装配与自动化生产。若需样品或批量采购,可参照完整规格书确认环境和电气特性以完成最终设计验证。

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