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FOSAN 1SS355
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN 1SS355
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- 1SS355
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0264886515
- Current
- 100mA
- Diode
- 1
- Current(Ir)
- 100nA@80V
- (Vf)
- 1.2V@100mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SS355 产品概述
一、产品简介
1SS355 是 FOSAN（富信）出品的一款小功率开关二极管，采用 SOD-323 表面贴装封装。器件为独立式二极管，专为高速开关和小信号整流场合设计，具有较高的反向耐压与低漏电流特性，适用于便携设备、通信模块、保护与限幅电路等密集贴片电路。
二、主要特性
- 直流整流电流：100 mA，满足小电流稳态整流需求。
- 反向耐压（Vr）：80 V，可承受较高的反向电压。
- 正向压降（Vf）：1.2 V @ 100 mA，典型导通电压值便于计算功耗。
- 反向电流（Ir）：100 nA @ 80 V，低漏电有利于高阻抗电路。
- 反向恢复时间（Trr）：4 ns，响应速度快，适合开关应用。
- 非重复峰值浪涌电流（Ifsm）：225 mA，可承受短时冲击电流。
- 功耗耗散（Pd）：200 mW，属于低功耗等级。
- 工作结温范围：-50 ℃ ~ +150 ℃，适应较宽的环境温度范围。
三、电气与热管理要点
1SS355 为小功率器件，200 mW 的耗散功率决定了在 100 mA 工作点时需关注压降带来的发热。实际应用中建议在器件工作于连续导通或高频切换状态时进行适当热裕量设计，避免长期在额定功耗上运行以延长寿命。器件的低反向电流和较快的 Trr 有利于提高开关效率并降低漏失。
四、典型应用场景
- 小信号整流与隔离电路
- 高阻抗输入保护、反向极性防护
- 高频开关与脉冲整流场合
- 手持设备、传感器前端及通信模块的小电流保护与限幅
五、封装与可靠性
SOD-323 小型表贴封装，适合高密度 PCB 布局和自动化贴装。器件在 -50 ℃ 至 +150 ℃ 的结温范围内保持性能稳定，符合常见消费与工业级温度要求。推荐在 PCB 布局时为二极管预留合理的焊盘面积以保证良好焊接与机械可靠性。
六、使用与焊接建议
- 支持常见回流焊工艺，建议遵循元件供应商或通用焊接曲线进行温度控制，避免过冲。
- 在高温回流或多次回流工序中应注意器件的热疲劳。
- 对于靠近额定功耗工作点的应用，建议分配散热路径或降低工作电流以保证长期可靠性。
- 存储时避免潮湿环境，按贴片器件常规防潮要求处理。
七、选型与替代注意
选型时应结合实际工作电流、反向电压裕量和开关速度要求。若项目对漏电极为敏感或需更高功率余量，可考虑同类更高 Pd 或更低 Vf 的器件；若需求更高的浪涌承受能力或更快恢复时间，可在器件族内或其他封装中查找替代型号。总体而言，1SS355 在小功率、80 V 等级的开关/保护应用中具有良好的性价比与封装适配性。
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