WMSIC Electronic Components

FOSAN BZT52C5V6S

ModelBZT52C5V6S
PackageSOD-323
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C5V6S
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C5V6S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.025g
Electronic Component
1
(Zzt)
400Ω
Electronic Component
BM0264886510
Diode
1
Current(Ir)
50nA
Power Dissipation(Pd)
200mW
Electronic Component
5.2V~6V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C5V6S — BZT52 系列 5.6V 稳压二极管(FOSAN 富信,SOD-323,200mW)

一、产品概述

BZT52C5V6S 是 FOSAN(富信)推出的一款独立式低功耗稳压二极管,标称稳压值 5.6V,适用于低电流、小功率的基准与稳压场合。器件采用 SOD-323 小封装,最大耗散功率 Pd=200mW,工作结温范围宽(-65℃ 至 +150℃),适合表面贴装工艺的轻薄电路设计。

二、主要电气参数

  • 稳压值(标称):5.6V(范围 5.2V ~ 6.0V)
  • 反向电流 Ir:50 nA(典型/最大等级)
  • 动态阻抗 Zzt:400 Ω(表征小信号下的阻抗,影响稳压精度)
  • 最大耗散功率 Pd:200 mW(在规定散热条件下)
  • 工作结温范围:-65℃ ~ +150℃
  • 封装:SOD-323(表面贴装,体积小,热阻相对较高)

三、应用场景

BZT52C5V6S 以其小体积和低功耗特性,常用于以下场合:

  • 低功耗便携设备的电压基准或参考点
  • 数字电路的电平钳位、输入保护与竖直稳压
  • 模拟前端或传感器电路中的辅助稳压
  • 浪涌抑制与过压保护(需注意能量限制,不适合大能量冲击)

四、使用注意与设计建议

  • 作为并联(分流)稳压器时,应通过串联电阻限制电流:R = (Vin - Vz) / Iz。选择 Iz 时需兼顾器件 Pd 限制(Pd = Vz × Iz),通常在低 mA 级别工作以保证长期可靠。
  • 由于 Zzt 较大(400Ω),该器件不适合要求高精度或低噪声的参考源;若需高精度请选用低阻抗的精密稳压二极管或专用参考源。
  • SOD-323 封装散热能力有限,布局时应优化铜箔散热面积,避免长期在高结温下工作;必要时进行功率降额。
  • 焊接时遵循厂商推荐的回流曲线与操作规范,防止过热损伤元件。

五、可靠性与包装

器件工作结温范围宽,适合工业级应用。出厂通常以卷带包装适配贴片机,便于批量 SMT 装配。为保证长期可靠性,应避免超过 Pd 和 Tmax 规定,并在高湿环境中采取防潮措施。

总结:BZT52C5V6S(FOSAN,SOD-323)是一款面向低功耗、小信号稳压与钳位的实用型稳压二极管,适合体积与功耗受限的设计场合。在选型与电路设计时需重视功率限额和动态阻抗的影响,以获得稳定可靠的使用效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.