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FOSAN BZT52C24
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C24
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C24
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzt)
- 60Ω
- Electronic Component
- BM0264886294
- Diode
- 1
- Current(Ir)
- [email protected]
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 22.8V~25.6V
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C24（FOSAN 富信）产品概述
一、产品简介
BZT52C24 是一款独立式低功耗稳压二极管，标称稳压值 24V，单只耗散功率 500mW，采用 SOD-123 表面贴装封装，由 FOSAN（富信）品牌提供。该器件适用于小功率稳压、基准源和浪涌钳位等应用场景，结构紧凑，便于自动贴片与批量生产。
二、主要电气参数
- 稳压值（标称）：24V（典型范围 22.8V ~ 25.6V）
- 反向漏电流 Ir：50nA @ 16.8V（低漏电，适合高阻环境）
- 稳压阻抗 Zzt：60Ω（在测试电流下的动态阻抗，影响纹波抑制能力）
- 最大耗散功率 Pd：500mW（结温和环境温度相关）
- 工作结温范围：-65℃ ~ +150℃
根据 Pd 与 Vz 的关系，器件理论最大稳压电流 Iz_max ≈ Pd / Vz ≈ 500mW / 24V ≈ 20.8mA。为提高可靠性与热裕度，建议在实际设计中对工作电流进行适当降额（例如取额定的一半左右）。
三、热与可靠性要点
SOD-123 为小型低热阻封装，但热量主要由焊盘和 PCB 散热能力决定。长期连续工作时应：
- 计算并验证结温：Tj = Ta + Pd * θJA（根据 PCB 布局的 θJA 实测或数据手册参考）；
- 在高环境温度下降低稳流以避免超过 Pd；
- 推荐将稳压二极管工作电流控制在 10–15mA 范围内以延长寿命并保持温升可控。
四、典型应用
- 小功率稳压与电压基准（为低功耗电路提供稳定参考）
- 电压钳位与浪涌保护（输入尖峰吸收）
- 电平移位、信号保护与仪器仪表局部稳压
由于 500mW 的功率级别适合中低电流场合，常用于通信模块、传感器前端和便携式设备的局部稳压电路。
五、选型与电路设计建议
- 若输入电压高于稳压值，应在二极管前串联限流电阻 R = (Vin - Vz) / Iz 以限制稳压电流，并计算电阻功耗 PR = (Vin - Vz) * Iz。
- 考虑 Zzt 对稳压精度与纹波抑制的影响，纹波较大时需降低电流或改用低阻抗器件/并联滤波电容。
- 反向漏电在多数应用可忽略，但对超低电流电路应核算其影响。
- 在高温或持续冲击条件下应选用更高功耗等级或并联多只器件分担能量。
六、封装与焊接注意事项
SOD-123 适合自动贴装与回流焊。焊接时遵循 SMD 回流焊标准曲线（峰值温度不超过器件规格要求），注意避免过热导致性能退化。器件表面通常有极性标志（阴极带），贴装时务必确认极性。储存与装配过程中应防潮，并注意 ESD 防护。
总结：BZT52C24（FOSAN）以其 24V 稳压、低漏电及小型 SOD-123 封装，适用于中低功率稳压与钳位场景。设计时重视热管理与电流降额，可在保证稳定性的前提下实现可靠、小型化的电路方案。
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