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FOSAN BZT52C5V1S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C5V1S
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C5V1S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.025g
- Electronic Component
- 1
- (Zzt)
- 425Ω
- Electronic Component
- BM0264886295
- Diode
- 1
- Current(Ir)
- 200nA@2V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 4.8V~5.4V
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C5V1S — FOSAN（富信）5.1V 200mW SOD-323 稳压二极管产品概述
一、产品简介
BZT52C5V1S 为单颗独立式稳压二极管（齐纳二极管），由 FOSAN（富信）生产，标称稳压值 5.1V，采用 SOD-323 小型封装。器件适用于微功率电源稳压、参考电压以及浪涌钳位等场合，体积小、可靠性高，便于贴片自动化生产。
二、主要电气参数
- 标称稳压：5.1V（稳压值允许范围 4.8V ~ 5.4V）
- 最大耗散功率 Pd：200mW（在额定条件下）
- 反向电流 Ir：200nA @ 2V（表示在低电压时的漏电性能）
- 动态阻抗 Zzt：425Ω（影响稳压精度与纹波抑制能力）
- 工作结温度范围：-65℃ ～ +150℃
理论上在额定耗散下的最大稳压电流 Iz_max ≈ Pd / Vz ≈ 200mW / 5.1V ≈ 39mA，但SOD-323小封装对环境和散热敏感，实际应用中建议留有余量并采取降额设计。
三、封装与热特性
SOD-323 为小型表面贴装封装，适合空间受限的电路板。由于封装体积小，热阻较大，需注意功耗与环境温度的影响。长时间高功率工作时应降低稳流电流或采用散热良好的PCB设计并注意器件热限。
四、典型应用场景
- 小型低功耗电源稳压和基准电压
- 信号线浪涌钳位与过压保护
- MCU、电池供电设备的局部稳压与保护电路
- 精简型电源模块和便携设备
五、使用与布局建议
- 设计时按最大功耗和环境温度进行功率降额，推荐实际稳压电流远低于理论 Iz_max；常见取值 ≤ 10–20mA 更为稳妥。
- 在输入端加限流电阻以控制流过齐纳二极管的电流并分担功耗。
- 布局上增大铜箔面积极有助于散热；避免将热源包围器件。
- 在需要低噪声、高精度稳压场合，考虑采用更低动态阻抗或精度更高的参考源。
六、品质与可靠性
器件工作结温覆盖宽温区间（-65℃～+150℃），适合工业级应用。FOSAN（富信）作为品牌供应商，提供批量一致性及表面贴装工艺兼容性，适用于中低功耗稳压与保护设计。使用前建议结合实际工况参考完整器件数据手册，确认测试条件和典型曲线以保证设计可靠性与寿命。
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