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FOSAN BZT52C4V7S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C4V7S
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C4V7S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.025g
- Electronic Component
- 1
- (Zzk)
- 410Ω
- (Zzt)
- 80Ω
- Electronic Component
- BM0264886273
- Diode
- 1
- Current(Ir)
- 3uA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 4.4V~5V
- Electronic Component
- 65℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C4V7S 产品概述
一、产品简介
BZT52C4V7S 为 FOSAN（富信）出品的一款独立式稳压二极管，封装为 SOD-323 小型贴片封装，标称稳压值 4.7V。器件为单只（独立式）稳压二极管，适用于低功耗、小尺寸电路的基准与稳压保护场合。
二、主要电气参数
- 标称稳压：4.7V（允许范围 4.4V ~ 5.0V）
- 反向泄漏电流 Ir：3 μA（在额定反向电压条件下测试）
- 最大耗散功率 Pd：200 mW（器件在 25°C 时的最大耗散功率）
- 稳压阻抗 Zzt：80 Ω（测试点工作区的动态阻抗）
- 膝部阻抗 Zzk：410 Ω（低电流区的阻抗特性）
- 工作结温范围：-65°C 至 +150°C
这些参数表明器件适合微功耗稳压与过压钳位，稳压性能在小电流范围内较为稳定，但在低电流或过载时阻抗上升明显。
三、封装与热管理
SOD-323 为超小型表面贴装封装，适合空间受限的移动终端与消费电子。由于封装体积小，热阻较大，须注意PCB散热设计：在需要较高稳压电流时应增大焊盘铜箔面积或使用热铜垫以提高功耗散逸能力。器件在 25°C 时 Pd=200 mW，建议按线性温度降额：随结温上升按约 1.6 mW/°C 进行降额，以防结温超限。
四、典型应用场景
- 低功耗供电轨稳压（传感器、MCU 的参考源）
- 电源过压钳位与浪涌保护
- 电路基准及小信号电源滤波补偿
- 可穿戴、物联网终端、便携式设备的本地稳压与保护
五、使用建议与可靠性注意
- 推荐在稳压工作点附近（datasheet 指定测试电流）工作以获得最佳稳压精度。
- 避免长期在 Pd 极限附近工作，留足安全裕量并注意环境温度。
- SOD-323 适用于常规回流焊工艺，焊接参数遵循厂家推荐曲线以避免过热损伤。
- 在对稳压精度与温漂有严格要求的设计中，应结合温度系数与实际测试数据选型与配套元件。
本产品以小体积、低功耗和可靠性为特点，适合对尺寸和成本敏感的稳压与保护应用。具体电气特性与测试条件请参照完整规格书以获得准确设计数据。
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