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FOSAN RB521S-30 RB521S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN RB521S-30
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- RB521S-30
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0264886319
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 30uA@10V
- (Vf)
- 350mV@10mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB521S-30 肖特基二极管产品概述
一、产品简介
RB521S-30 是富信（FOSAN）出品的一款独立式肖特基二极管，采用超小型 SOD-523 封装，专为对正向压降和开关速度有较高要求的低功耗、空间受限电路设计而优化。该器件在小电流工作条件下具有极低的正向压降和较小的反向漏电，适用于便携设备、电源管理和信号整流等场景。
二、主要参数
- 二极管数量：1 个独立式
- 正向压降（Vf）：350 mV @ 10 mA
- 额定直流反向耐压（Vr）：30 V
- 平均整流电流（Io）：200 mA
- 反向电流（Ir）：30 µA @ 10 V
- 工作结温范围：-55 ℃ ~ +125 ℃
- 非重复峰值浪涌电流（Ifsm）：1 A
- 封装：SOD-523
三、特性与优势
- 低正向压降：在 10 mA 条件下 Vf≈350 mV，可有效降低导通损耗，延长电池供电设备的续航。
- 快速切换特性：肖特基结构使其反向恢复极小，适合高频整流与开关场合，减少开关损耗与 EMI。
- 小封装：SOD-523 占板面积小，适合高密度贴装与便携式产品设计。
- 宽温度范围：-55 ℃ 到 +125 ℃，满足工业级及消费类宽温应用需求。
- 耐浪涌能力：1 A 非重复峰值浪涌电流，可承受短时启动或瞬态脉冲。
四、典型应用场景
- 移动电源、手持设备的低压整流与保护电路；
- 开关电源次级整流或同步整流辅助；
- 功率路径切换、反向电流防护与极低电压降要求的电源管理；
- 高频信号整流与采样电路。
五、封装与热管理
SOD-523 为超小型表面贴装封装，适合自动贴片生产。由于封装体积小，器件的热阻较大，长期高电流运行时需注意散热：
- 在 PCB 设计上优先使用较宽的铜箔、增加散热通道或接底层散热铜皮；
- 若工作电流接近额定整流电流，应评估结温并预留热裕量；
- 推荐靠近被保护或驱动的 IC 布局以缩短走线，减少寄生电感。
六、使用注意与建议
- 反向电压不要超过 30 V；高温下反向漏电会增加，应在设计时考虑温升影响。
- 非重复峰值浪涌 1 A 仅限短时冲击（如开机浪涌），不作为连续工作电流使用准则。
- 在焊接与回流过程中遵循 SOD-523 的制造商推荐温度曲线，避免长时间高温曝晒影响可靠性。
- 对于关键路径建议加熔丝或限流保护以防瞬态过流损坏器件。
七、可靠性与选型参考
RB521S-30 以低 Vf 与小封装为主要卖点，适合对效率与体积敏感的应用。选型时应综合考虑工作电流、散热条件以及最大反向电压裕量；若电流或耐压要求更高，可考虑同家族更大封装或更高额定值的型号。采用前建议在目标温度与负载条件下进行样机测试以验证热性能与漏电表现。
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