WMSIC Electronic Components

FOSAN BZT52C3V6

ModelBZT52C3V6
PackageSOD-123
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C3V6
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C3V6
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.032g
Electronic Component
1
(Zzt)
85Ω
Electronic Component
BM0264886511
Diode
1
Current(Ir)
5uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
3.4V~3.8V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C3V6 产品概述

一、产品简介

BZT52C3V6 是一款独立式小功率稳压二极管(Zener),由 FOSAN(富信)提供,封装为 SOD-123。该器件以 3.6V 名义稳压值为设计目标,适用于小电流基准、浪涌/反向过压保护以及低功率稳压场合。体积小、便于表贴装配,适合集成到空间受限的消费类和工业电子设备中。

二、主要参数

  • 稳压值(标称):3.6V
  • 稳压值(范围):3.4V ~ 3.8V
  • 反向漏电流 Ir:典型 5 μA(在规定测试条件时)
  • 耗散功率 Pd:500 mW(器件最大耗散功率)
  • 动态阻抗 Zzt:85 Ω(在测试电流下的增量阻抗,表征稳压灵敏度)
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 封装:SOD-123,独立式单颗二极管

三、主要特性与优点

  • 小型 SOD-123 表贴封装,适合自动化贴装、回流焊工艺,节省 PCB 面积。
  • 低漏电流,有利于低功耗电路中减少静态损耗。
  • 额定耗散功率 500 mW,可满足低功率稳压与保护应用。
  • 3.6V 名义值适合为小型模拟电路或数字外围提供简单的基准/保护电压。
  • 动态阻抗相对较大(85 Ω),在需要高精度参考时需慎重选择,但在过压保护和简单稳压场合足够使用。

四、典型应用

  • 作为齐纳稳压源,为小电流模拟或数字电路提供参考电压或局部稳压。
  • 输入浪涌或反向电压保护(配合限流电阻或串联器件)。
  • 电池管理、便携式设备的电压钳位与防反接保护。
  • 功率不高的微控制器或传感器前端的保护与基准电路。

五、使用建议与注意事项

  • 工作电流选择:作为齐纳稳压器时,应保证稳压二极管在其稳定区域工作。常见做法是设计偏置电流在约 1 mA 至数 mA 范围;具体偏置电流应参考器件详细数据表的稳压曲线。
  • 限流电阻计算:Rs = (Vin_min - Vz) / (Iz + Iload),其中 Iz 为稳压二极管偏置电流,Iload 为外部负载电流。确保在所有工况下器件耗散功率不超过 500 mW。
  • 功耗与热管理:500 mW 为器件最大耗散额定值,实际工作时需考虑环境温度与 PCB 散热能力,必要时通过加大铜箔面积或降低器件电流来降低结温。高温环境下应按照厂方提供的功率降额曲线进行降额设计。
  • 精度与噪声:由于较高的动态阻抗,该器件不适合要求低噪声、高精度的参考源应用;若需高精度,请选用低阻抗、低温漂的专用参考芯片。
  • 反向漏电流会随温度上升而增加,敏感电路需考虑漏电对待机功耗的影响。

六、封装与安装

  • SOD-123 为常用小型表贴封装,适合回流焊和自动化生产。建议按照 J-STD-020 等回流曲线进行焊接。
  • 推荐在 PCB 上为二极管留有适当的散热铜箔,便于器件热量传导到板体。
  • 存储与搬运应防潮、防静电,避免超温、过压或机械应力。

七、可靠性与环境适应

  • 工作结温范围宽(-65 ℃ ~ +150 ℃),适应工业温度等级要求。
  • 在高温或长时间高功耗应用中,应采取功率降额与良好散热措施以延长寿命。
  • 出于可靠性考虑,对于关键应用建议参照厂商完整可靠性试验和应力测试报告,或进行额外的系统级验证。

结语:BZT52C3V6(FOSAN)是一款面向低功耗稳压与过压保护的经济型 SOD-123 齐纳二极管。设计时应重视功率与热管理、动态阻抗对稳压性能的影响,以及在具体电路中的偏置电流选择,以确保器件在可靠、安全的工作区间内长期稳定运行。

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