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FOSAN BZT52C11
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BZT52C11
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BZT52C11
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.032g
- Electronic Component
- 1
- (Zzt)
- 8Ω
- Electronic Component
- BM0264886303
- Diode
- 1
- Current(Ir)
- 100nA@8V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 10.4V~11.6V
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C11 稳压二极管（FOSAN，SOD-123）产品概述
一、产品简介
BZT52C11 是一款独立式低功耗稳压二极管，标称稳压值 11V，耗散功率 500mW，封装为 SOD-123，品牌 FOSAN（富信）。该器件适用于表面贴装电路中的基准电压、稳压并联保护与过压钳位等场景，体积小、热稳定性好，适合中小功率的电源与信号保护设计。
二、主要电气参数
- 稳压值（标称）：11V（范围 10.4V ～ 11.6V）
- 反向电流 Ir：100nA @ 8V（低漏电流，便于作参考源）
- 稳压阻抗 Zzt：8Ω（在测试条件下具备较低动态阻抗，稳压性能良好）
- 耗散功率 Pd：500mW（封装热能力限值）
- 工作结温：-65℃ ～ +150℃
三、应用要点与典型计算
- 并联稳压（分流式稳压）：在并联稳压应用中，电流 Iz = (Vin - Vz) / Rs。器件允许的最大电流约为 Iz_max = Pd / Vz ≈ 0.5W / 11V ≈ 45mA，建议设计时留有裕量（通常按 50%～70% 退让），长期工作电流可取 10～20mA 以延长寿命并减小发热。
- 举例：若 Vin=15V，目标 Iz=10mA，则 Rs=(15-11)/0.01=400Ω，Rs 耐压功率 P = (4V*0.01A)=40mW。
- 过压钳位与浪涌保护：适合吸收短时过压，但总能量受限于封装与热耗散能力，必要时配合限流电阻或浪涌抑制器使用。
四、封装与装配建议
SOD-123 为常见的 SMD 小型封装，便于自动贴装与回流焊接。为保证热散与可靠性：
- 在 PCB 布局时为二极管留足铜箔面积做散热台，必要时扩大焊盘或加热沉铜层；
- 遵循回流曲线和焊接工艺规程，避免过高的预热/峰值温度与多次回流；
- 存储与焊接前注意防潮等级（若厂家提供数据，请参照）。
五、可靠性与选型注意
- 工作环境温度范围宽（-65℃ 至 +150℃），适用于工业级温度要求；
- 低漏电与较低阻抗使其适合要求稳定参考的小信号电路，但若需高精度或低温漂基准，应选用配套温度补偿设计或专用参考源；
- 选型时注意稳压值容差范围（10.4V～11.6V），若系统对稳压精度要求高，应挑选配对分选或考虑更精密器件。
六、典型应用场景
- 小功率并联稳压与基准电压源；
- 输入过压钳位与信号线保护；
- 电池管理、仪表与传感器前端的简单参考源；
- 嵌入式设备与通讯终端的电源保护元件。
综上，BZT52C11（FOSAN，SOD-123）以其紧凑封装、500mW 功率能力、低漏电与较低稳压阻抗，适合用于中低功耗场合的稳压与保护设计。具体电气特性、回流工艺与热阻等详细参数建议参考厂商完整数据手册并在目标电路中进行实测验证。
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