Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOSAN US2MB
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN US2MB
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- US2MB
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.19g
- Electronic Component
- 1
- Electronic Component
- BM0264886271
- Current
- 2A
- Current(Ir)
- 5uA
- (Vf)
- 1.7V@2A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 1kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
US2MB 快恢复/高效率二极管 2A SMB 产品概述
一、产品简介
US2MB 是 FOSAN（富信）推出的一款2A额定整流电流的快恢复/高效率二极管，采用SMB（DO-214AA）封装。器件面向通用整流与开关电源场合，兼顾低正向压降与较快的反向恢复特性，适合在高峰值浪涌条件和高压环境中工作。
二、主要技术参数
- 正向压降 (Vf)：1.7V @ If = 2A
- 直流反向耐压 (Vr)：1000V
- 连续整流电流：2A（TC和散热条件限定）
- 反向漏电流 (Ir)：5µA（常温、额定Vr条件）
- 反向恢复时间 (Trr)：70ns
- 非重复峰值浪涌电流 (Ifsm)：60A
- 工作结温范围：-65℃ ~ +150℃
- 封装：SMB（DO-214AA）
- 品牌：FOSAN（富信）
三、主要特性与优势
- 高耐压设计：1kV 反向耐压满足高压整流与高压开关应用需求。
- 低正向压降：在2A工作点上1.7V的正向压降有助于降低导通损耗，提高效率。
- 快恢复性能：70ns 的反向恢复时间有效降低开关损耗和电磁干扰（EMI），适合高频开关电路。
- 强抗浪涌能力：60A 峰值冲击电流在开机冲击和短时过载情况下提供可靠保护。
- 宽温度范围：-65℃至+150℃的工作结温适应苛刻环境与工业级应用。
四、典型应用场景
- 开关电源（SMPS）整流与续流二极管
- 逆变器与电机驱动的续流环路
- 高压电源整流与分压保护
- 太阳能微型逆变器与光伏系统内高压整流
- 通用工业电源、充电设备与电源模块
五、热与可靠性特性
SMB 封装具备中等散热能力，实际允许的连续整流电流受PCB散热设计限制。建议在PCB设计上采用散热铜箔、加大焊盘面积并辅以过孔导热，以降低结-壳温差，确保在高结温条件下长期可靠工作。器件典型的反向漏流在高温时会上升，需在电路设计中预留裕量。
六、封装与安装建议
- 封装：SMB，适配常见SMB贴片焊盘。
- PCB 布局：将二极管放置在散热良好的区域，焊盘采用较大铜面积并辅以多孔过孔，减少热阻。
- 走线：输入/输出走线尽量粗短以降低寄生电感和压降，减少开关瞬态应力。
- 焊接：遵循一般无铅回流焊温度曲线，避免超出器件耐热极限。
七、储存与使用注意事项
- 储存于干燥、洁净、无腐蚀性气体环境，避免长时间潮湿暴露。
- 在高温或高压工作时注意器件的自热与散热设计，避免长时间处于Ifsm或高结温状态。
- 处理时注意避免机械应力集中与反复弯折引脚焊盘，确保焊接可靠性。
八、选型与替代考量
US2MB 以1kV 耐压和2A 整流能力定位于中高压整流市场。若需更低正向压降或更快恢复时间，可比较肖特基或超快恢复二极管系列；若需更大连续电流或更强散热能力，可考虑DO-214AB（SMC）封装或多串并联方案。采购时请确认生产批次与出货测试报告以保证性能一致性。
如需具体电气曲线、封装尺寸图或典型应用电路图，可提供更详细资料与支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
