WMSIC Electronic Components

FOSAN MMBT3904

ModelMMBT3904
PackageSOT-23
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN MMBT3904
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
MMBT3904
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
Electronic Component
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264881607
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
200mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT3904(NPN型小信号晶体管)产品概述

MMBT3904是FOSAN(富信)推出的通用型NPN小信号晶体管,采用SOT-23贴片封装,兼具稳定电气性能与宽温适应性,广泛应用于消费电子、工业控制等领域。以下是该器件的详细概述:

一、产品基本信息

  • 晶体管类型:NPN型
  • 品牌与型号:FOSAN(富信)MMBT3904
  • 封装形式:SOT-23(贴片式)
  • 配置:独立式单管
  • 核心定位:通用小信号放大/开关管,兼顾低频放大与低速开关功能

二、核心电气参数详解

MMBT3904的参数经过优化,满足多场景需求,关键参数如下:

2.1 直流参数

  • 集射极击穿电压(VCEO):40V(集电极-发射极反向耐压,保障电路安全)
  • 集电极截止电流(ICBO):50nA(反向漏电流小,器件漏电控制良好)
  • 射基极击穿电压(VEBO):6V(发射极-基极反向耐压,需避免过压)
  • 集射极饱和电压(VCE(sat)):300mV(@IC=50mA、IB=5mA)——开关应用中低损耗的关键

2.2 交流参数

  • 特征频率(fT):300MHz(截止频率,反映高频放大能力,适配中等频率场景)
  • 直流电流增益(hFE):典型值70(放大倍数稳定,一致性好,适合信号放大)

2.3 功率与电流参数

  • 最大集电极电流(IC(max)):200mA(连续工作电流上限)
  • 最大耗散功率(Pd(max)):200mW(封装允许的最大功耗,需结合散热控制)

2.4 温度特性

  • 工作温度范围:-55℃~+150℃(宽温范围,适配工业级、车载等恶劣环境)

三、封装与物理特性

MMBT3904采用SOT-23贴片封装,具备以下特点:

  • 尺寸:标准SOT-23(长≈2.9mm,宽≈1.6mm,高≈1.1mm),体积小巧,适合高密度PCB布局
  • 引脚配置:丝印面(正面)引脚顺序为1=发射极(E)、2=基极(B)、3=集电极(C),需注意识别
  • 安装方式:表面贴装(SMD),支持回流焊与手工焊接,适配自动化生产与小批量调试

四、典型应用场景

基于性能特点,MMBT3904适用于:

  1. 小信号放大:音频前置放大、传感器信号放大(如温度/压力传感器输出)
  2. 低速开关:小功率LED驱动、数字逻辑开关(TTL/CMOS接口)
  3. 工业控制:宽温环境下的控制电路(如-40℃~+85℃工业现场)
  4. 消费电子:手机、遥控器、小型家电的信号处理单元(按键扫描、状态指示)
  5. 通信辅助:简单射频前端放大(如FM频段,利用300MHz fT)

五、性能优势总结

  1. 稳定性高:漏电流小(50nA),hFE一致性好,长期工作可靠
  2. 宽温适配:-55℃~+150℃覆盖工业级与部分车载应用
  3. 小体积:SOT-23封装节省PCB空间,适合便携设备
  4. 开关优异:低饱和压降(300mV)降低开关损耗
  5. 性价比突出:通用型器件,成本可控,适合批量生产

六、使用注意事项

  1. 功耗限制:实际功耗≤200mW,避免长时间超电流/电压
  2. 焊接要求:手工焊烙铁温度≤350℃,时间≤3秒;回流焊符合SOT-23温度曲线
  3. 静电防护:佩戴静电手环,使用防静电工具,避免静电击穿
  4. 反向耐压:发射极-基极反向电压≤6V,防止击穿

以上概述覆盖核心参数、封装、应用与注意事项,可作为选型与使用参考。

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