WMSIC Electronic Components

FOSAN BZT52C7V5S

ModelBZT52C7V5S
PackageSOD-323
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN BZT52C7V5S
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
BZT52C7V5S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.025g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
30Ω
Electronic Component
BM0264886287
Diode
1
Power Dissipation(Pd)
200mW
Electronic Component
7V~7.9V
Electronic Component
65℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C7V5S 产品概述

一、概述

BZT52C7V5S 为独立式稳压二极管(箝位/齐纳二极管),封装为 SOD-323,适用于低功率电压稳压与浪涌保护。该器件由 FOSAN(富信)品牌提供,设计用于在小体积表贴电路中实现稳压、基准和瞬态抑制功能。

二、主要规格

  • 稳压值(标称):7V(实际范围 7.0V ~ 7.9V)
  • 耗散功率 Pd:200 mW(在推荐结温/环境条件下)
  • 动态阻抗 Zzt:30 Ω(测量条件下)
  • 斜率阻抗 Zzk:80 Ω(低电流或开路时特性)
  • 工作结温范围:-65 ℃ ~ +150 ℃
  • 二极管配置:1 个独立式
  • 封装:SOD-323(小型表贴)

三、电气特性说明

稳压值为器件在特定测试电流下的导通电压,实际电压会随电流和温度变化。动态阻抗(Zzt、Zzk)表征在规定电流区间内电压随电流变化的斜率,阻抗越低器件稳压性能越好。耗散功率 Pd 决定最大允许的稳流能力,近似最大稳流 Iz_max = Pd / Vz(例如 0.2W / 7V ≈ 28.6 mA),实际应取更低余量以保证可靠性。

四、热管理与封装影响

SOD-323 为小型塑封,热阻较大,器件在 PCB 上的散热依赖焊盘面积与铜箔导热。200 mW 功耗在常温下可满足低电流稳压,但在高环境温度或持续更高电流时需降额使用。设计时应增大焊盘铜箔,优化过孔或散热铜皮,必要时并联元件或选用更高功率封装替代。

五、典型应用

  • 小型电源的局部稳压与参考电压
  • 信号线与电路的过压保护、浪涌钳位
  • 工业控制、通信和消费电子中的电压抑制与保护电路

六、设计与选型建议

  • 按 Iz_max = Pd / Vz 计算稳流上限并留安全裕度,推荐工作电流远低于计算值(例如 ≤ 20 mA)。
  • 考虑温度漂移与稳压范围(7.0–7.9 V),用于需精密基准的场合应加温度补偿或选择精密稳压器。
  • PCB 设计优化焊盘与铜厚,必要时使用散热 vias 增强散热。
  • 若需要更低动态阻抗或更高功率,应选择更大封装或功率更高的系列产品。

七、质量与可靠性

器件工作结温范围宽(-65 ℃ 至 +150 ℃),适应恶劣环境。建议在产品验证阶段进行温度循环、湿热和功率老化测试,以确认在目标应用中的长期稳定性。选型时参考厂商详细数据手册以获取典型曲线与最大额定值。

八、采购与替代

购买时确认封装(SOD-323)、采购批次与原厂标识。BZT52 系列有不同稳压值与功率等级,可以根据电路需求选择相邻电压或更高功率型号作为替代。若对稳压精度或功率有更高要求,考虑更高功率的 SOD-123 或 DO-214 等封装产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.