Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5817W是国内半导体厂商富信(FOSAN)推出的一款低压降肖特基二极管,采用SOD-123小型表面贴装封装,核心定位为低压大电流整流、续流及高频开关场景。其以低正向压降、宽温工作范围为核心优势,适配消费电子、工业控制、汽车辅助电路等多领域需求,以下从核心参数、封装特性、应用场景等维度详细解析。
B5817W的关键参数明确了其应用边界与性能表现,核心参数如下:
SOD-123是主流的小型表面贴装二极管封装,具有以下优势:
富信是国内专注于功率半导体器件的厂商,产品覆盖肖特基二极管、快恢复二极管、三极管等,以高性价比、稳定可靠为核心竞争力,广泛应用于家电、通信、工业控制、汽车电子等领域。B5817W作为其低压肖特基系列的主力产品,经过多轮可靠性测试(如高温存储、温度循环),满足工业级及部分汽车级应用要求。
结合B5817W的参数特性,其典型应用场景包括:
如5V/12V手机充电器、LED驱动电源的次级整流,利用低Vf减少导通损耗,提升电源效率(可较普通硅管提升3%-5%效率);
在BUCK(降压)、BOOST(升压)电路中作为续流二极管,肖特基的无反向恢复时间特性可减少开关损耗,适配几十kHz至几百kHz的高频开关;
如移动电源的充放电控制、蓝牙耳机的充电电路,小型SOD-123封装适配便携设备的紧凑设计;
如PLC(可编程逻辑控制器)的12V辅助电源、传感器信号处理电路,宽温范围(-50~150℃)适应工业环境的温度波动;
如车载USB充电、车内LED照明的整流电路,12V系统反向耐压20V足够,宽温特性可适应汽车舱内的温度变化(-40~85℃)。
与同类型肖特基二极管对比,B5817W的差异化优势明显:
型号 反向耐压 正向压降@3A 封装 优势 B5817W 20V 750mV SOD-123 小型化、低Vf、宽温 1N5817 20V ~800mV DO-41 直插、成本低(无贴装) B5819W 40V ~780mV SOD-123 高耐压(适配24V系统) SS12 20V ~800mV SMA 封装稍大、电流1A可见,B5817W在低压、小型化、低损耗场景下更具竞争力,适合需要贴装且空间紧凑的应用。
B5817W是一款高性价比的低压肖特基二极管,以低正向压降、宽温工作、小型化封装为核心特点,覆盖消费电子、工业控制、汽车辅助电路等多领域。选型时需注意其20V反向耐压的边界,实际应用需结合环境温度适当降额,以保障电路可靠性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products