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FOSAN SS54B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN SS54B
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- SS54B
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.19g
- Electronic Component
- 1
- Electronic Component
- BM0264881635
- Current
- 5A
- Diode
- 1
- Current(Ir)
- 100uA@40V
- (Vf)
- 550mV@5A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS54B 产品概述
FOSAN（富信）SS54B 为一款高性能肖特基势垒整流二极管，单颗独立封装（SMB），专为中高电流、低压降整流场合设计。该器件在5A整流电流下具有典型正向压降约0.55V，反复性好、切换速度快、散热性能适中，适用于开关电源、DC-DC 降压模块、整流、反向保护与二极管 OR-ing 等多种电源管理场景。
一、主要性能特点
- 低正向压降：Vf ≈ 0.55V @ If = 5A，降低导通损耗，提升效率。
- 中等反向耐压：直流反向耐压 Vr = 40V，适合低压电源系统。
- 小反向漏电：Ir = 100μA @ 40V（典型室温条件），在多数低功耗应用中表现良好。
- 工作温度范围宽：结温范围 -65℃ ~ +150℃，适应较苛刻温度环境。
- SMB 封装：便于自动贴装、波峰或回流焊接，兼顾机械强度与散热面积。
二、主要技术参数（概要）
- 型号：SS54B（FOSAN 富信）
- 封装：SMB（独立式）
- 额定整流电流：5A（连续）
- 直流反向耐压：40V
- 正向压降：550mV @ 5A
- 反向电流：100μA @ 40V（典型）
- 工作结温：-65℃ ~ +150℃
三、封装与机械及热特性建议
SMB 封装提供了相对较大的引脚与焊盘面积，有利于热量通过焊盘传导到 PCB。推荐在高电流应用中采用加大铜箔、设置热过孔（thermal vias）并尽量缩短导线路径，以降低结温并保证长期可靠性。焊接时参照厂家回流焊曲线和SMB封装规范，避免过长高温暴露。
四、典型应用场景
- 开关电源输出整流与次级整流
- DC-DC 降压转换器的肖特基整流二极管
- 反向极性保护（OR-ing）与续流回路
- 工业与通信电源模块、部分车载电子低压子系统（注意瞬态抑制）
五、使用与选型注意事项
- 温度对反向漏电有较大影响：在高温工作条件下，Ir 会显著增加，应在热设计中留有裕量。
- 若系统存在高压浪涌或瞬态，应配合 TVS 或 RC 吸收电路保护，避免超出 Vr 极限。
- 对于需要更高耐压或更低漏电的场合，可考虑更高 Vr 或更低 Ir 的替代型号。
- 在需要更低正向压降以进一步降低损耗的高功率设计中，可对比其他大电流肖特基或同步整流方案。
六、存储与可靠性提示
建议按照行业标准进行干燥保存和防潮处理，避免长期暴露在高湿环境中影响焊接性与可靠性。出货前应遵循供应商提供的可靠性数据与寿命评估，关键应用（如汽车或医疗）建议进行必要的器件级与系统级验证。
总结：FOSAN SS54B 在 5A 级别的低压整流领域提供了良好的性能与封装便利性，适合多数中低压、高频整流与保护应用。正确的热管理与系统防护可确保其在长期运行中的稳定性与可靠性。
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