Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
FOSAN BAV21WS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- FOSAN BAV21WS
- Type
- FOSAN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- FOSAN
- Electronic Component
- BAV21WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0264886268
- Current
- 250mA
- Current(Ir)
- 100nA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV21WS 产品概述
一、产品简介
BAV21WS（品牌：FOSAN 富信）是一款小型开关/整流二极管，采用 SOD-323 表面贴装封装，面向快速开关与小信号整流应用。器件在紧凑体积下兼顾较高的反向耐压与快速恢复特性，适合空间受限的高密度电路板设计。
二、主要电气参数
- 最大耗散功率（Pd）：200 mW
- 最大整流电流：250 mA（连续直流）
- 直流反向耐压（Vr）：250 V
- 正向压降（Vf）：1.25 V @ If = 0.2 A
- 反向电流（Ir）：100 nA（典型/最大值，常温、小电压条件下）
- 反向恢复时间（Trr）：50 ns
- 工作结温范围：-50 ℃ ~ +150 ℃
三、性能特点
- 高反向耐压（250 V），适合高电压前端和隔离电路中的小信号处理。
- 快速恢复（Trr = 50 ns），切换损耗小，适用于频率较高的开关场合。
- 低漏电（Ir 约 100 nA），在高阻输入或精密检测电路中可降低误差与功耗。
- 小封装（SOD-323）利于节省 PCB 面积，适配自动化贴装与回流工艺。
- 宽工作温度范围（-50 ℃ 至 150 ℃），满足工业级乃至部分汽车电子场景的温度要求。
四、典型应用场景
- 开关电源的高压整流与钳位电路
- 高频/脉冲信号的整流与保护（如混合信号接口）
- 电压检测、波形钳位、反向保护电路
- 空间受限的便携设备与工业控制模块
- 汽车电子的非关键小信号路径（需按车规验证）
五、封装与热管理
SOD-323 小封装便于高密度布板，但热阻相对较大。200 mW 的耗散功率在小封装中接近上限，实际应用应注意功率余量与散热路径：
- 在 PCB 布局中增加散热过孔或铜箔面积以改善热传导。
- 在高占空比或高环境温度下采取降额设计，避免长期靠近最高 Pd 工作。
- 采用标准无铅回流焊工艺焊接，遵循器件制造商的焊接曲线与应力控制建议。
六、选型与注意事项
- 若电路存在较高反复脉冲电流，需评估瞬态热与平均功率，考虑更高 Pd 或更大封装型号。
- 正向压降在 0.2 A 时约 1.25 V，若在低压差或效率敏感场合使用，应核算额外损耗。
- 反向电流在高温下会上升，精密检测回路应考虑温漂影响。
- 对于汽车或功能安全类应用，建议参考厂家完整数据手册并做额外可靠性验证。
七、可靠性与测试建议
- 推荐在样机阶段做温度升高测试、反向耐压寿命和反向恢复波形分析，确认在目标工作频率下无异常发热或开关损耗。
- 做批次间的参数抽检（Vf、Ir、Trr）以确保一致性，尤其在大量并联或并联-串联混合使用场景下。
综上，BAV21WS（FOSAN，SOD-323）是适合中高压、小电流、需要快速开关响应场合的经济型二极管。合理的热管理与降额使用能显著提升其长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
