WMSIC Electronic Components

FOSAN HT7550

ModelHT7550
PackageSOT-89-3
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN HT7550
Type
FOSAN
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
100mV@(1mA)
Electronic Component
FOSAN
Electronic Component
HT7550
Electronic Component
1
Package
SOT-89-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.146g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0228561516
Operating Temperature
25℃~+70℃
Operating Voltage
30V
Output
Electronic Component
Output Voltage
5V
Output Current
100mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HT7550(FOSAN 富信)5V 100mA 线性稳压器 产品概述

一、产品简介

HT7550 是富信(FOSAN)推出的一款固定输出型低压差线性稳压器(LDO),输出为正极性 5V,额定输出电流 100mA。器件具有短路保护功能,工作环境温度范围为 -25℃ 至 +70℃,静态电流(Iq)非常低,仅 2µA,适合对静态功耗要求严格的应用。器件采用 SOT-89-3 小型封装,便于表面贴装于中小型电子设备板上。HT7550 可在较高输入电压条件下工作(资料中工作电压列为 30V),同时常用于 24V 等工业供电系统的降压稳压场合。

二、主要规格与性能亮点

  • 输出类型:固定(5.0V)
  • 最大输出电流:100mA
  • 静态电流(Iq):2µA(极低待机功耗,利于电池供电与待机设计)
  • 短路保护:内置限制/保护机制,提高系统鲁棒性
  • 压差(Dropout):100mV @ 1mA(在轻载时表现为低压差;需注意 heavier load 时压差会增大)
  • 输入电压能力:可用于 24V 系统,规格中工作电压标识至 30V(设计时请参照最新规格书)
  • 工作温度范围:-25℃ 至 +70℃
  • 封装:SOT-89-3,体积小、成本低、便于自动贴装

HT7550 的显著优势在于极低的静态电流与小体积封装,适合对待机损耗敏感且空间受限的场合;同时固定 5V 输出便于为数字电路、MCU 等提供稳定电源。

三、热耗与效率计算与注意事项

作为线性稳压器,HT7550 的损耗等于压降乘以负载电流:Pd = (Vin - Vout) × Iout。

  • 以 24V 输入、5V 输出、满载 100mA 为例:Pd = (24 − 5)V × 0.1A = 1.9W。
  • 若输入为 30V,则 Pd = (30 − 5)V × 0.1A = 2.5W。

这类功率在 SOT-89 小封装上会产生大量热量,若无足够的 PCB 散热或降额运行,器件温升会很高,可能导致热关断或长期可靠性下降。因此在设计时必须重视热管理:

  • 减少输入电压差:尽量在靠近 5V 的预稳压或采用开关降压器把中高压先降到较低值,再由 HT7550 做低噪声精稳压。
  • 限制连续输出电流:在高 Vin 下避免长期满载运行。
  • 提供良好 PCB 散热:加大接地铜箔面积、在器件底部与散热焊盘相连、增加热铜层与通孔,以降低器件结壳热阻。
  • 必要时考虑改用散热能力更强的封装或切换为开关电源以显著减小功耗。

关于效率:线性稳压器的效率近似为 Vout/Vin。按 24V 输入计算,效率约 5/24 ≈ 20.8%;按 30V 输入约 16.7%。在高输入电压与较大输出电流场合,效率非常低,热損显著。

四、典型应用场景

  • 工业控制系统中把 24V 或更高直流源转换为稳定的 5V 给 MCU、传感器或逻辑电路供电(短时间脉冲或低平均负载场景更为合适)。
  • 便携或待机设备:利用 2µA 的超低静态电流作为备用电源管理或低频唤醒电路的局部稳压源。
  • 噪声敏感的模拟前端:线性器件本身输出噪声低于开关稳压器,适合对噪声敏感的 ADC、放大器供电(在热管理可控的前提下)。

五、设计与 PCB 实施建议

  • 输入/输出旁路电容:遵循器件数据手册对输出电容类型与容量的要求;常见做法为在输出端放置 1µF10µF 的低 ESR 陶瓷或钽电容,并在输入端放置 1µF10µF 的陶瓷电容以抑制输入源阻抗与尖峰。
  • 布局:输入电容靠近器件 VIN 引脚放置,输出电容靠近 VOUT 与 GND 引脚放置,减少寄生感抗和回流环路面积。
  • 熔断/保护:对于可能出现长期短路或过载的场合,设计熔断或外部电流限制以防止反复热循环导致损伤。
  • 接地处理:将 GND 通过较宽的铜箔与地平面良好连接,减小热阻并优化散热。

六、保护行为与可靠性建议

HT7550 自带短路保护,有助于应对意外短路,但短路状态下器件将承受较大功耗并可能进入热关断循环。建议在关键应用中:

  • 增加外部限流或保险元件以避免持续过热;
  • 进行热仿真与实际温升测试,验证在最坏工况下结温不超过规格。

七、封装与选型注意

SOT-89-3 小封装体积小、成本低,适合空间受限的板载稳压需求。但在高 Vin × Iout 条件下需谨慎使用。选型时请参考富信 HT7550 的完整数据手册,确认引脚定义、典型电气特性、输出精度、纹波抑制(PSRR)等关键参数,以便与系统要求匹配。

总结:HT7550 以其低静态电流、低压差(轻载)与小封装优势适合低功耗、噪声敏感或空间受限的 5V 稳压场合。但当输入电压较高且需要持续 100mA 输出时,必须重点考虑热量管理与效率问题;在此类工况下,评估是否采用预调或替换为开关降压方案更为稳妥。若需进一步的电气特性曲线、引脚图和典型应用电路,请查阅厂商完整数据手册或提供具体工况以便给出更细化的设计建议。

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