WMSIC Electronic Components

FOSAN 1N4007W

Model1N4007W
PackageSOD-123FL
BrandFOSAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
FOSAN 1N4007W
Type
FOSAN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
FOSAN
Electronic Component
1N4007W
Electronic Component
1
Package
SOD-123FL
Electronic Component
General Purpose Diode
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0228561502
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.1V@1A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N4007W 产品概述

一、产品简介

1N4007W 是一款通用整流二极管,FOSAN(富信)品牌,采用 SOD-123FL 表面贴装封装,额定整流电流 1A、直流反向耐压达 1000V。该器件针对高压、低频整流和一般保护电路设计,具有结构简单、成本低、可靠性高的特点,适合电源、整流桥、浪涌吸收及反向保护等场景。

二、主要电气参数

  • 正向压降 Vf:1.1V @ 1A(在额定整流电流工作时的典型压降,实际值随温度和电流略有变化)
  • 直流反向耐压 Vr:1000V(最高反向持续电压)
  • 反向电流 Ir:5μA @ 1000V(常温下的漏电流性能)
  • 整流电流 If(AV):1A(连续正向整流电流)
  • 非重复峰值浪涌电流 Ifsm:25A(允许短时浪涌,如半正弦冲击)

三、封装与热管理

SOD-123FL 为低剖面 SMD 封装,适合自动贴装与回流焊,节省 PCB 面积。正向工作时在 1A 下产生约 1.1W 的功耗,须注意 PCB 铜箔面积和散热设计:加大接地/电源线铜箔、使用过孔与散热面积可有效降低结温,延长器件寿命。

四、典型应用场景

适用于低频整流、电源输入整流、整流桥单元、高压电源保护、反向电流防护与一般浪涌吸收。由于属于慢恢复整流二极管,不推荐在高频开关电源或高速脉冲电路中替代快恢复或肖特基器件。

五、使用与选型建议

选择时关注实际工作电压余量与环境温度:若长期在高温或接近 1000V 条件下工作,应考虑更高耐压或更低漏电的器件。对于需低正向压降或快速恢复的应用,建议改用肖特基或快恢复型号。板级布局应保证良好散热并避开高频噪声敏感区。

六、焊接与储存注意

推荐按 SMD 回流焊工艺温度曲线焊接,避免超温或长时间回流导致封装应力。储存时防潮防静电,打开防潮包装后按 MSL 要求及时使用。

七、总结

1N4007W(FOSAN,SOD-123FL)是一款面向高压、低频整流和通用保护的可靠器件。其 1000V 耐压和 1A 连续整流能力使其在传统电源和高压保护电路中仍具实用价值;在设计时应重视热管理与应用频率匹配,以获得稳定可靠的工作表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.