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GOODWORK MMBT5551
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- GOODWORK MMBT5551
- Type
- GOODWORK
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GOODWORK
- Electronic Component
- MMBT5551
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0264757972
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 300mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT5551 产品概述
一、概述
MMBT5551（GOODWORK 品牌，SOT-23 封装）是一款高压 NPN 小信号晶体管，设计用于高压开关与放大场合。器件标称集电极-发射极击穿电压 Vceo 为 160V，集电极电流 Ic 可达 600mA，耗散功率 Pd 为 300mW，适合在空间受限的表面贴装电路中承担中等功率、高压任务。
二、主要特性
- 晶体管类型：NPN（小信号/开关型）
- Vceo：160V（高压耐受，适合高压侧驱动与开关）
- 最大集电极电流 Ic：600mA（瞬态和短时负载能力强）
- 耗散功率 Pd：300mW（SOT-23 封装下的功率限制）
- 直流电流增益 hFE：300（高放大倍数，适合小电流放大）
- 特征频率 fT：300MHz（高速开关与高频放大性能良好）
- 集电极截止电流 Icbo：50nA（低漏电流，有利于高阻输入电路）
- 饱和电压 VCE(sat)：典型 200mV（低饱和电压，导通损耗小）
- 射基极击穿电压 Vebo：6V
- 工作温度范围：-55℃ ~ +150℃
三、封装与引脚
封装：SOT-23，适合自动贴装生产。典型引脚排列（自面向标记的一面，按标准封装）：
- 引脚1：B（基极）
- 引脚2：E（发射极）
- 引脚3：C（集电极）
在设计 PCB 时应留意 SOT-23 的散热面积和焊盘布局，以优化热扩散。
四、热管理与可靠性注意
SOT-23 封装的热阻较大，额定耗散功率 300mW 是在标准环境下的上限。实际应用中建议：
- 尽量减少持续耗散于晶体管上的功率（P = Vce × Ic）；
- 在高功率或连续开关场景采用限流、分担或外部散热（如铜箔散热面）；
- 若长期工作接近额定 Pd，应进行热仿真和寿命评估，避免结温超过器件允许值。
五、典型应用场景
- 高压开关与驱动电路（如继电器、功率 MOSFET 驱动）
- 小信号放大器、前置放大与射频电路（fT=300MHz 适合中高频）
- 电平转换、高压保护与信号隔离电路
- 开关电源辅助电路与欠压/过流检测
六、使用建议与电路提示
- 驱动基极时建议串联限流电阻，以保护基极并控制开关速度；
- 在开关高速切换时并联 RC 或钳位电路以抑制电压尖峰，防止 Vce 超过 160V；
- 由于 hFE 较高，器件在低电流放大时表现良好，但在高电流饱和状态下应注意 hFE 下降；
- 对于持续大电流应用，优先考虑功率封装或采用并联器件分担电流。
七、采购与替代型号
GOODWORK（固得沃克）品牌的 MMBT5551 适用于小批量与大批量生产。常见替代型号包括 MMBT5551 的其他品牌版本或 2N5551（引脚与参数需核对）。采购时注意封装、参数一致性及批次可靠性测试。
总结：MMBT5551 在高压、小体积、高增益和较好高频响应之间取得平衡，适合需要高压耐受与快速响应的表面贴装电路。设计时关注功率耗散与热管理即可发挥其最佳性能。
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