WMSIC Electronic Components

GOODWORK BZT52C10

ModelBZT52C10
PackageSOD-123
BrandGOODWORK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
GOODWORK BZT52C10
Type
GOODWORK
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GOODWORK
Electronic Component
BZT52C10
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
(Zzk)
150Ω
(Zzt)
20Ω
Electronic Component
BM0257623377
Diode
1
Current(Ir)
200nA@7V
Power Dissipation(Pd)
500mW
Electronic Component
9.4V~10.6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C10 产品概述

BZT52C10 是一款独立式小功率稳压二极管(Zener diode),标称稳压值为 10V,封装为 SOD-123。该器件适用于小电流稳压、电平钳位、基准源及一般电路中的浪涌保护与噪声抑制场合。GOODWORK(固得沃克)品牌提供的这款 BZT52C10 在空间受限的表贴应用中兼顾体积和基本的稳压性能,是许多消费电子与工业控制中常用的成本效益型器件选择。

一、主要电气参数说明

  • 配置:独立式(单只稳压二极管)
  • 标称稳压值:10V
  • 稳压值范围(公差):9.4V ~ 10.6V
  • 反向电流 Ir:200 nA @ 7V(表明在较低电压下的漏电特性)
  • 耗散功率 Pd:500 mW(器件最大耗散,受 PCB 散热条件影响)
  • 动态阻抗 Zzt:20 Ω(在稳压工作点的增量阻抗)
  • 动态阻抗 Zzk:150 Ω(通常指在较小电流或开机瞬态时的阻抗)
  • 封装:SOD-123(表面贴装)

注:阻抗 Zzt、Zzk 与稳压特性通常在制造商指定的测试电流下测得;实际应用中这些参数会随工作电流和温度发生变化。反向漏电 Ir 会随温度升高呈显著上升趋势,设计时需考虑温度影响。

二、特点与优势

  • 小封装、节省 PCB 面积:SOD-123 适合高密度表贴电路。
  • 低漏电:在 7V 条件下反向电流仅 200 nA,适合低功耗和高阻抗节点的稳压/钳位应用。
  • 中等稳压精度:9.4V–10.6V 的范围适合一般用途的 10V 参考或保护,不适合高精度基准场合。
  • 适合瞬态钳位:较低的体积与快速响应,使其能用于浪涌和反向瞬变保护。

三、典型应用场景

  • 小电流稳压源与基准电压(非高精度场合)
  • 输入浪涌或反向电压钳位保护
  • 放大器或 ADC 的粗略基准、偏置网络
  • 数字/模拟接口的过压保护
  • 低成本消费电子与便携设备中的局部电压稳定

四、热设计与功耗考量

BZT52C10 在产品规格上标称 Pd=500 mW,但这是在良好散热条件(如大面积铜箔)下的最大耗散。SOD-123 属于小体积封装,实际在 PCB 上的可用耗散通常低于标称值。设计时建议:

  • 根据稳压电流 Iz 与输入电压差计算二极管功耗 Pz = Vz × Iz,并保证 Pz 小于器件在特定 PCB 布局下的安全耗散。
  • 在需要持续较大功率耗散的场合,增加周围铜箔面积或使用散热通孔以降低结-环境热阻。
  • 考虑温度漂移:稳压电压随结温变化,会影响稳压精度与漏电。

五、封装与焊接建议

  • 封装:SOD-123,适用于常规回流焊工艺。建议按照供应商的回流曲线与焊接规范操作以避免过热或机械应力。
  • PCB 布局:为改善散热与热均匀性,扩展焊盘铜箔面积;在需要时通过过孔把热量导至内层或底层铜箔。
  • 储存与搬运:尽量避免长时间潮湿暴露,按常规元件防静电与防潮措施处理。

六、选型与替代建议

  • 若电压精度需求更高,应选择公差更小、温漂更优的低温度系数基准源或更严格公差的稳压二极管系列。
  • 若工作电流或功耗超出 SOD-123 能力范围,考虑使用功耗更高的封装(如 DO-214 等)。
  • 对于极低泄漏要求或高温环境,应参考器件的温度特性曲线并选择适合的型号。

七、典型使用提示(设计步骤)

  1. 确定稳压点 Vz(本器件为 10V)与所需输出电流/负载。
  2. 选择稳压电流 Iz(使稳压特性良好但不超过功耗限制)。
  3. 计算限流电阻 R = (Vin - Vz) / Iz ,并验证二极管功耗 Pz = Vz × Iz 与电阻功耗是否满足器件与系统散热能力。
  4. 在 PCB 上留出足够铜面积以实现可靠耗散和长期稳定。

订购时请注明型号 BZT52C10、封装 SOD-123 及品牌 GOODWORK(固得沃克),并参照其具体数据手册获取完整的试验条件与温度特性曲线,以确保在目标应用中满足全部电气与热性能要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.