Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Gigadevice GD25Q64ESIG
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Gigadevice GD25Q64ESIG
- Type
- GIGADEVICE
- Minimum package
- 9500 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- GIGADEVICE
- Electronic Component
- GD25Q64ESIG
- Electronic Component
- 1
- Package
- SOP-8-208mil
- Electronic Component
- NOR FLASH
- Electronic Component
- 1.5g
- Electronic Component
- 1
- Electronic Component
- BM69418290
- Operating Voltage
- 2.7V~3.6V
- Interface Type
- SPI
- Electronic Component
- 100000
- Clock Frequency(fc)
- 133MHz
- Electronic Component
- Electronic Component
- Electronic Component
- 9500
- (t BE)
- 250ms@(64KB)
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GD25Q64ESIG 产品概述
一、产品概述
GD25Q64ESIG 是北京兆易创新（Gigadevice）推出的一款高性能 NOR Flash 存储器。作为一款64Mbit的存储解决方案，GD25Q64ESIG 提供高达133MHz的读取速度，具有卓越的存储性能，非常适合广泛的应用场景，如嵌入式系统、消费电子、工业自动化等。
二、主要特点
存储容量 GD25Q64ESIG 提供64Mbit（8MB）的存储容量，满足了多种应用需求，无论是在微控制器、图像处理还是其他数据存储方面，都能提供足够的空间。
高速读取 最高可达133MHz的读取速率确保了快速的数据访问能力，适合高性能的应用场景，能够有效提升系统的整体响应速度。
工作温度范围 此款 NOR Flash 产品的温度范围为 -40℃至 +85℃，保证了在严苛环境条件下的可靠性和稳定性，适合工业、汽车电子等需要高耐久性的领域。
电压范围 GD25Q64ESIG 以2.7V至3.6V的工作电压广泛兼容多种电源设计，为设计师提供更大的灵活性，满足不同电源电路的需求。
封装规格 该产品采用 SOP-8-208mil 封装形式，适合多种PCB设计，可以在狭窄的空间内提供高密度的集成，方便在现代设备中的应用。
兼容性 GD25Q64ESIG 还具有兼容性，可以方便地与市场上大多数主流的微控制器和系统集成电路(CIC)协同工作，降低了研发成本和时间。
三、应用领域
GD25Q64ESIG NOR Flash 存储器适用于众多领域，包括但不限于：
- 嵌入式系统：为微控制器提供持久的存储解决方案，能够存储固件、配置数据及用户数据。
- 消费电子：广泛应用于家电、智能手机、平板电脑等设备中，作为存储媒介。
- 汽车电子：可用于车载信息娱乐系统、仪表盘及汽车控制器等关键电子系统，确保数据的读写稳定性和耐用性。
- 工业控制：在工业设备中用于存储控制逻辑、参数调整及数据采集，能够在恶劣环境下稳定工作。
四、总结
GD25Q64ESIG 作为一款高性能、低功耗的 NOR Flash 存储器，凭借其优异的性能参数、广泛的应用适应性和高可靠性，成为了当前市场上理想的存储解决方案之一。其特色的快速读取能力、宽广的工作温度范围及优秀的电压适应能力，使其能够满足各种设计需求，助力工程师和开发者们在各类电子项目中实现创意与设计的结合。随着物联网、智能家居等新兴技术的快速发展，GD25Q64ESIG 将会在未来的电子应用中扮演更为重要的角色。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
