Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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GD25Q64ESIGR 是由 GigaDevice Semiconductor (HK) Limited 生产的一款高性能非易失性存储器,采用 NOR FLASH 技术,拥有64Mb(8M x 8)的存储容量,广泛应用于消费电子、工业控制、网络通信以及智能设备等领域。作为一种具有卓越速度和可靠性的闪存,GD25Q64 以其良好的存储性能和长寿命在市场中占有一席之地。
GD25Q64 配备了 SPI - 四 I/O 接口,使其在数据传输速度上具有明显优势。其时钟频率可达 133 MHz,能够实现高速的数据读取和写入,特别适合对响应时间有严苛要求的应用场景。该存储器的访问时间为 7 ns,这意味着它在数据访问时的延迟非常小,有利于提升整体系统的性能。
此外,GD25Q64 的写周期时间也经过优化:单字写入周期为 70µs,而整页写入的周期则为 2.4ms,这样的设计保证了在频繁写入操作时的效率,适应了工业应用中对快速响应和高写入频率的需求。
GD25Q64 的供电电压范围为 2.7V 到 3.6V,能够支持多种供电方案,使其在不同的工作环境下都能保持稳定的性能。工作温度范围为 -40°C 到 85°C,适合在极端环境下应用,满足工业和汽车等领域的需求。这种耐高低温的特性,保证了在各种环境条件下都能良好工作,确保系统的可靠性。
GD25Q64 采用 8-SOIC 封装,尺寸为 0.209",宽度为 5.30mm,设计为表面贴装型,便于与现代电子设备的焊接和集成。SOP-8 封装为设计人员提供了更高的集成度和灵活性,使其能够有效节省PCB空间,能够适用于小型化设计和高密度应用场景。
GD25Q64 是一款通用型的 NOR FLASH 存储器,适用于多种场合,如:
综上所述,GD25Q64ESIGR 作为一款高性能、可靠性强的 NOR FLASH 存储器,凭借其出色的存储技术、广泛的工作温度范围和合理的封装设计,满足了现代电子设备对存储器的高要求,适合众多应用领域。无论是在工业控制还是消费电子中,GD25Q64 都能为设计师提供理想的解决方案,助力他们在激烈的市场竞争中保持优势。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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