WMSIC Electronic Components

Gigadevice GD5F2GM7UEYIGR

ModelGD5F2GM7UEYIGR
PackageWSON-8(8x6)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD5F2GM7UEYIGR
Type
GIGADEVICE
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD5F2GM7UEYIGR
Electronic Component
1
Package
WSON-8(8x6)
Electronic Component
NAND FLASH
Electronic Component
0.308g
Electronic Component
1
Features
OTP and; ECC; positions
Electronic Component
BM0230013215
Electronic Component
2Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
50uA
Interface Type
SPI
Electronic Component
8

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD5F2GM7UEYIGR 产品概述

GD5F2GM7UEYIGR 是北京兆易创新(Gigadevice)推出的一款高可靠性 SPI 接口 NAND 闪存器件,容量为 2 Gbit(256 MB),采用 WSON-8(8 x 6 mm)封装,面向工业级与嵌入式存储应用。该器件在性能、耐久性和数据保护方面进行了优化,适合需要大容量、低引脚数、低功耗和高可靠性的场景。

一、主要规格一览

  • 存储容量:2 Gbit(256 MByte)
  • 接口类型:SPI,最大时钟频率 fc = 133 MHz
  • 工作电压:2.7 V ~ 3.6 V
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 页写入时间(Tpp):320 μs
  • 块擦除时间(tBE):3 ms
  • 数据保留(TDR):10 年
  • 擦写寿命:80,000 次
  • 待机电流:50 μA
  • 封装:WSON-8(8x6)

二、功能特性与数据完整性

GD5F2GM7UEYIGR 集成了全面的可靠性和保护机制:

  • 坏块管理(Bad Block Management),自动标记并管理不可用块,简化上层逻辑。
  • ECC 纠错功能,提升读写数据完整性,降低位错误风险。
  • 硬件写保护与软件写保护并存:包括写使能锁存(Write Enable Latch)与硬件写保护引脚,支持细粒度的数据保护策略。
  • OTP 区域写保护与锁定功能,用于存储不可更改的固件或密钥。
  • 读缓存功能,配合高达 133 MHz 的 SPI 时钟提高顺序读吞吐。
  • 软件复位与复制回写(Copy-back)等便利操作,利于系统级闪存管理与升级流程。

三、性能与应用场景

凭借 133 MHz 的 SPI 时钟和读缓存功能,器件在顺序读性能上具有优势,适合需要快速代码执行或流媒体读取的嵌入式系统。稳定的 2.73.6 V 电源范围和 -40+85 ℃ 工业温度等级,使其可用于工业控制、网关、路由器、车载电子(非功能安全关键路径)以及消费类存储扩展等领域。同时,80k 次擦写寿命和 10 年数据保留为长期部署提供可靠保障。

四、封装与系统集成建议

WSON-8(8 x 6 mm)紧凑封装适合空间受限的 PCB 布局。设计时建议注意:

  • 电源引脚增加去耦电容(如 0.1 μF + 1 μF),保证瞬态供电稳定。
  • SPI 总线走线尽量短并做好阻抗匹配,减少信号反射以支持 133 MHz 时钟。
  • 预留硬件写保护与复位控制走线,以便实现安全管理和异常恢复。
  • 在系统级实现坏块管理与磨损均衡策略,配合器件内置 ECC 可获得最佳寿命与稳定性。

五、总结

GD5F2GM7UEYIGR 将大容量 NAND 存储与高性能 SPI 接口结合,兼具工业级可靠性和丰富的数据保护特性。它适合对容量、成本、封装尺寸与可靠性有平衡要求的嵌入式与工业应用,是需要长期稳定存储与快速顺序访问场景的合适选择。若需详细电气特性、命令集和时序图,请参阅兆易创新的产品数据手册,以便完成硬件与固件的最佳集成。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.