WMSIC Electronic Components

Gigadevice GD5F1GM7UEYIGR

ModelGD5F1GM7UEYIGR
PackageWSON8(6x8)
BrandGigadevice
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Gigadevice GD5F1GM7UEYIGR
Type
GIGADEVICE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
GIGADEVICE
Electronic Component
GD5F1GM7UEYIGR
Electronic Component
1
Package
WSON8(6x8)
Electronic Component
NAND FLASH
Electronic Component
1g
Electronic Component
1
Features
OTP and; ECC; positions
Electronic Component
BM0229928687
Electronic Component
1Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
50uA
Interface Type
SPI
Electronic Component
8

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GD5F1GM7UEYIGR 产品概述

一、产品简介

GD5F1GM7UEYIGR 是北京兆易创新(Gigadevice)推出的一款 1Gbit SPI NAND 闪存器件,面向嵌入式存储与代码/数据存储应用。器件支持最高 133MHz 的 SPI 时钟频率,工作电压范围为 2.7V 至 3.6V,工作温度范围为 -40℃ 到 +85℃,封装为 WSON8 (6x8),在容量、性能和可靠性之间取得平衡,适合对成本与可靠性有要求的消费类、工业控制与联网终端产品。

二、主要规格

  • 存储容量:1 Gbit
  • 接口类型:SPI(支持 133MHz 时钟)
  • 工作电压:2.7V ~ 3.6V
  • 写页时间 (Tpp):约 320 μs
  • 块擦除时间 (tBE):约 3 ms
  • 数据保留 (TDR):10 年
  • 擦写寿命:80,000 次
  • 待机电流:典型 50 μA
  • 工作温度:-40℃ ~ +85℃
  • 封装:WSON8 (6x8)

三、功能特性

  • 坏块管理功能(Bad Block Management),支持跳过和标记坏块。
  • 硬件写保护功能(WP),保障关键区域不被非授权写入或擦除。
  • 读缓存(Read Cache)功能,提升随机访问与顺序读性能。
  • OTP 区域写保护与锁定,用于存放序列号、校验码等不可更改数据。
  • 内置 ECC(纠错)功能,提供可靠的数据完整性保护。
  • 软件复位(Software Reset)功能,支持系统异常恢复。
  • 复制回写(Copy Back)功能,提高页内部数据移动效率,减少主机负载。
  • 写使能锁存(Write Enable Latch)与软件写保护(Software Protection)机制,细化写入权限控制。

四、典型应用场景

  • 嵌入式系统代码存储与启动(Boot ROM 替代)
  • 智能家居、物联网终端数据存储
  • 消费电子配置与参数保存
  • 工业控制器与测量设备中保存校准/日志数据
  • 固件与小容量文件系统应用

五、设计与使用建议

  • 电源与时钟:建议在 VCC 上使用充分旁路电容(例如 0.1 μF + 1 μF),保证电源稳定;上电/掉电顺序按器件说明书执行以避免数据损坏。
  • ECC 与 坏块管理:尽管器件内置 ECC,仍建议主机文件系统(或 Flash 管理层)配合做更高层次的磨损均衡与坏块映射以延长寿命。
  • 写保护与 OTP:将关键参数存放在 OTP 区并锁定,利用硬件写保护管脚实现在生产与部署阶段不同保护策略。
  • 抑制干扰:高频 SPI 通信线建议走短线并加适当阻抗匹配/串联阻阻尼,必要时加滤波以降低信号反射与 EMI。
  • 擦写与写入策略:合理安排写入合并与对齐到页/块边界,尽量减少不必要的擦写操作以延长擦写寿命(80k 次)。

六、可靠性与测量

GD5F1GM7UEYIGR 的数据保留保证为 10 年,在 -40℃ 至 +85℃ 的工业温度范围内可稳定工作。典型的页写入与块擦除延时分别为 320 μs 与 3 ms,可用于预测系统的写入延迟与响应时间。待机电流低至 50 μA,有利于低功耗系统设计。

七、封装与供应信息

  • 品牌:Gigadevice(北京兆易创新)
  • 封装:WSON8 (6x8),适合自动贴片生产
  • 型号示例:GD5F1GM7UEYIGR(请在设计与采购时核对完整料号与规格书)

如需进入原理图级接入、引脚定义、电气时序或参考设计示意,请提供具体的应用场景与电路要求,以便给出更详细的硬件设计建议。

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